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LG U250 Service Manual

LG U250 Service Manual

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Service Manual
U250/KU250
Date: June, 2007 / Issue 1.0

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Summary of Contents for LG U250

  • Page 1 Service Manual U250/KU250 Date: June, 2007 / Issue 1.0...

  • Page 2: Table Of Contents

    4.17 Headset path...109 4.18 Speaker phone path...111 4.19 Main microphone ...113 4.20 Headset microphone...115 4.21 Vibrator ...117 5. DOWNLOAD...119 5.1 U250/KU250 DOWNLOAD ...119 5.1.1 Introduction ...119 5.1.2 Downloading Procedure ...119 5.1.3 Troubleshooting Download Errors 129 5.1.4 Caution ...133 6. BLOCK DIAGRAM ...134 6.1 GSM &...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2.1 System Overview Item Shape GSM900/1800/1900 and WCDMA2100 - Bar type Handset Size 110.9 X 46.7 X 15.6 mm Weight Under 83 g (with 950mAh Battery) Power 3.7 V normal, 950 mAh Li-Ion Talk Time Over 200 min (WCDMA, Tx=12 dBm, Voice) (with 950mAh) Over 180 min (GSM, Max Tx Power, Voice) Standby Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference TA Power * CLA : 12 ~ 24 V(DC) 2.3 Radio Performance 1) Transmitter - GSM Mode Item...
  • Page 8 Item MS allocated Channel Radiated Spurious Emission Idle Mode Frequency Error Phase Error Frequency Error Under Multipath and Interference Condition Due to modulation Output RF Spectrum Due to Switching transient * In case of DCS : [A] -> 1710, [B] -> 1785 30M ~ 1GHz -36dBm 1G ~ 4GHz...
  • Page 9 2. PERFORMANCE Item Intermodulation attenuation Transmitter Output Power Burst timing – Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±5 ±5 ±5 ±5 Mask IN - 10 - DCS &...
  • Page 10 2) Transmitter - WCDMA Mode Item Maximum Output Power Frequency Error Open Loop Power control in uplink Inner Loop Power control in uplink Minimum Output Power Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB Transmit OFF Power Transmit ON/OFF Time Mask Change of TFC Power setting in uplink compressed Occupied Bandwidth(OBW)
  • Page 11 2. PERFORMANCE Item Adjacent Channel Leakage Ratio(ACLR) Spurious Emissions (*: additional requirement) Transmit Intermodulation Error Vector Magnitude (EVM) Transmit OFF Power 3)Receiver - GSM Mode Item Sensitivity (TCH/FS Class II) Co-Channel Rejection (TCH/FS Class II, RBER, TU high/FH) Adjacent Channel 200kHz Rejection 400kHz...
  • Page 12 4) Receiver - WCDMA Mode Item Reference Sensitivity Level Maximum Input Level Adjacent Channel Selectivity (ACS) In-band Blocking Out-band Blocking Spurious Response Intermodulation Characteristic Spurious Emissions 2. PERFORMANCE Specification -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz...

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption 1) U250/KU250 Current Consumption Stand by Under 2.80 mA WCDMA (DRX=1.28) Under 2.12 mA Paging=9 period (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR...

  • Page 14: Battery Bar

    2.6 Battery BAR Indication Bar 4 Bar 4 → 3 Bar 3 → 2 Bar 2 → 1 Bar 1 → Empty Low Voltage, Warning message+ Blinking Power Off 2. PERFORMANCE Standby Over 3.83 ± 0.05V 3.82 ± 0.05V 3.73 ± 0.05V 3.68 ±...

  • Page 15: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) Idle Noise-Receiving (INR)

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3.1 General Description The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad- band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module).

  • Page 18: Gsm Mode

    DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U250/KU250, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS- 1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx.
  • Page 19 3. TECHNICAL BRIEF The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance.
  • Page 20 3. TECHNICAL BRIEF [Fig 1.2] RTR6275 RX feature - 21 -...

  • Page 21: Gsm Transmitter

    3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass- band symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.

  • Page 22: Umts Mode

    3. TECHNICAL BRIEF 3.3 UMTS Mode 3.3.1 Receiver The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter.
  • Page 23 3. TECHNICAL BRIEF WCDMA_2100_TX WCDMA_2100_RX [Figure 1.4] RTR6275 IC functional block diagram - 24 -...

  • Page 24: Lo Generation And Distribution Circuits

    3.4 LO generation and distribution circuits The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF.
  • Page 25 3. TECHNICAL BRIEF 3.5.2 VCTCXO (X100 : DSA321SCE-19.2M) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC. TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ.
  • Page 26 3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M) • Input power management - Valid external supply attachment and removal detection - Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources - Supports lithium-ion main batteries - Trickle, constant current, constant voltage, and pulsed charging of the main battery - Supports coin cell backup battery (including charging) - Battery voltage detectors with programmable thresholds - VDD collapse protection...
  • Page 27 3. TECHNICAL BRIEF • Integrated handset-level user interfaces - Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers - Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments - Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives external 8 Ω...
  • Page 28 3. TECHNICAL BRIEF [Figure1.7] PM6650 Block Diagram - 29 -...
  • Page 29 3. TECHNICAL BRIEF 3.5.5 GSM PAM (U101 : SKY77318) The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency. The small size and high performance is achieved with high-reliability GaAs HBT technology. With 50Ω...
  • Page 30 A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; • Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB •...
  • Page 31 3. TECHNICAL BRIEF 3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1) • Frequency range : 2110 ~ 2170MHz An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include: •...
  • Page 32 3.5.8 Bluetooth (M100 : LBRQ-2B43A) The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system architecture in the U250/KU250. [Figure1.9] Bluetooth system architecture 3. TECHNICAL BRIEF...

  • Page 33: Digital Baseband(Dbb/Msm6245)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6245) 3.6.1 General Description A. Features(MSM6245) • Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE • Support for WCDMA (UMTS) uplink data rate up to 384 kbps • High-performance ARM926EJ-S running at up to 225 MHz •...
  • Page 34 Bluetooth RF Module VCTCXO GSM Block GSM900 Tx TX SAW GSM1800/1900 Tx GSM900 Rx GSM1800 Rx GSM1900 Rx WCDMA Block Front Module WCDMA WCDMA COUPLER TX SAW WCDMA2100 Tx Duplexer WCDMA2100 Rx WCDMA RX SAW AntSW Logic Figure 1.10 Simplified Block Diagram 3.

  • Page 35: Block Diagram(Msm6245)

    3. TECHNICAL BRIEF 3.7 Block Diagram(MSM6245) CAMERA PROCESSING (Default 8bit Interface) Camera 1.3M GRAPHICS Open GL ES VGA camera 3D, 2D VIDEO MPEG-4 H.263, H.264 AUDIO MP3, AAC, EVRC, QCELP AMR, CMX, MIDI Figure 1.11 Simplified Block Diagram of MSM6245 SDRAM NAND Flash 512Mbit...

  • Page 36: Subsystem(Msm6245)

    3.8 Subsystem(MSM6245) 3.8.1. ARM Microprocessor Subsystem The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices.
  • Page 37 3. TECHNICAL BRIEF 3.8.3. GSM features The following GSM modes and data rates are supported by the MSM6245 device hardware. Support modes conform to release '99 specifications of the sub-feature. ■ Voice features ❏ FR ❏ EFR ❏ AMR ❏ HR ❏...
  • Page 38 3.8.6. MSM6245 device audio processing features ■ Integrated wideband stereo CODEC ❏ 16-bit DAC with typical 88 dB dynamic range ❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path ■ VR- Voice mail + voice memo ■...
  • Page 39 3. TECHNICAL BRIEF 3.8.9. Supported multimedia features ■ Provide additional general purpose MIPS by using: ❏ Two QDSP4000s ❏ Dedicated hardware accelerators and compression engines ■ Improve Java, BREW, and game performance ❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine ■...
  • Page 40 3. TECHNICAL BRIEF ■ PNG decoder ■ Pitch bend range support ■ LED/vibrate support ■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) ■ MLZ decoder ■ Integrated PNG/SAF A.T. Table 1-1 Summary of MSM6245 device features Note: 1.
  • Page 41 3. TECHNICAL BRIEF Table 1-2 Description of RF configurations - 42 -...

  • Page 42: Vocoder Subsystem

    3. TECHNICAL BRIEF 3.8.10. Stereo Wideband CODEC The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing the external component count to just a few passive components.
  • Page 43 3. TECHNICAL BRIEF 3.8.14. General-Purpose Input/Output Interface The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

  • Page 44: Power Block

    3. TECHNICAL BRIEF 3.9 Power Block 3.9.1. General MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are : 3.9.2. PM6650 The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics.
  • Page 45 3. TECHNICAL BRIEF Figure 1.12 PM6650 Functional Block Diagram - 46 -...
  • Page 46 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 4.2V~3.82V 3.81V~3.74V 100~70 (%) 69~45 (%) Figure 1.13 U250/KU250 Battery Bar Display(Stand By Condition) 3. TECHNICAL BRIEF 3.73V~3.69V 3.68V~3.59V 44~20 (%) 19~3 (%) - 47 - 3.58V~3.20V...
  • Page 47 3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V).
  • Page 48 3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

  • Page 49: External Memory Interface

    3. TECHNICAL BRIEF 3.10 External memory interface The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SDRAM, etc. •...
  • Page 50 EBI1 ADDRESS[14: 0] DATA[31:0] SDRAM CAS* 512Mb RAS* CLK_EN DQM[3:0] Figure 1.14 Simplified Block Diagram of Memory Interface 3. TECHNICAL BRIEF EBI2 NAND_CS* NAND_RE* NAND_WE* NAND_CLE NAND_WP* MSM6245 NAND_ALE NAND_READY DATA[7:0] - 51 - NAND 512Mb (64MB)

  • Page 51: H/W Sub System

    3. TECHNICAL BRIEF 3.11 H/W Sub System 3.11.1. RF Interface A. RTR6275(WCDMA_Tx, GSM_Tx/Rx) MSM6245 controls RF part(RTR6275) using these signals. • SBST : SSBI I/F signals for control Sub-chipset • PA_ON1 : Power AMP on RF part • RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF •...
  • Page 52 3. TECHNICAL BRIEF B. the others • TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA(2100) TX Power Amp Enable • ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) • GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp • GSM_PA_RAMP : Power Amp Gain Control of APC_IC •...

  • Page 53: Msm Sub System

    3. TECHNICAL BRIEF 3.11.2. MSM Sub System 3.11.2.1. USIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx MSM6245 3.11.2.2.
  • Page 54 3.11.2.3. USB The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1.
  • Page 55 3. TECHNICAL BRIEF 3.11.3 HKADC(House Keeping ADC) The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the internal HKADC.

  • Page 56: Key Pad

    3.11.4. Key Pad There are 23 main key buttons in Figure. Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650). COL0 ROW(0) ROW(1) ROW(2) ROW(3) ROW(4) VREG_MSMP_2.7V KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) KEY_ROW(4) KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) PM_ON_SW_N COL1 COL2 Table.

  • Page 57: Camera Interface

    3. TECHNICAL BRIEF 3.11.5 Camera Interface U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type connector and camera I/F signal. CAMERA MEGA CAMERA CONNECTOR CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7) ICVE21184E150R500FR CAM_DATA(0)
  • Page 58 The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 59 3. TECHNICAL BRIEF The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.

  • Page 60: Keypad Light

    3.11.6 Keypad Light There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from PM6650. +VPWR LD400 LEBB-S14H LD403 LEBB-S14H LD406 LEBB-S14H REV_B : EDLH0013501 --> EDLH0006001 KYBD_BACKLIGHT Figure 1.22 Schematic of KEY back light circuit (KEY side) KEY_BACK_LIGHT LED(8EA) R411 100ohm...
  • Page 61 3. TECHNICAL BRIEF 3.11.7. LCD Module (NM176CN1 : Tovis) - The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.
  • Page 62 3. TECHNICAL BRIEF 3.11.8.1. Audio Signal Processing & Interface Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6245).
  • Page 63 3. TECHNICAL BRIEF MSM6245 CODEC pins C200 C201 VREG_MSMP_2.7V R401 5.1K C400 0.1u VIN- R404 HOOK_KEY VIN+ MIC2N U400 MIC2P NCS2200SQ2T2G HPH_L HPH_R USB_D+ USB_D- EAR_SENSE_N VBATT AUDIO Near to MSM C204 C212 0.1u SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 Figure 1.25 Audio part schematics I/O CONNECTOR 2.2K MICBIAS...
  • Page 64 AUDIO +VPWR C410 SPK- 0.01u SPK_RCV- RCV- REV_B : SUMY0010301 --> SUMY0003802 MIC400 OB4-15L42-C33L REV_B : EDTY0008606 --> EDTY0008601 Figure 1.27 Audio part schematics SELECT_SPK&RCV U401 NLAS5223BMNR2G COM2 COM1 R421 R422 C416 R424 2.2K C418 C419 - 65 - 3. TECHNICAL BRIEF SPK+ SPK_RCV+ RCV_EN_N...
  • Page 65 3. TECHNICAL BRIEF SPK_AMP_EN REV_C : 20K --> 3K C422 0.1u R428 5.6K R427 LINE_N C423 0.1u R429 LINE_P R430 Audio AMP NCP2890DMR2 OUTB R426 U402 BYPASS OUTA 5.6K R431 C431 L401 100nH SPK_RCV- L402 100nH SPK_RCV+ REV_E : For Antenna Radiation Audio part schematics - 66 - SPK-...
  • Page 66 Headset Speaker phone Loud Mode Loud Mode MIDI Headset Loud Mode Headset Audio & Sound Main Component There are 6 main components in U250/KU250. Component MSM6245 Audio amp Analog Switch Speaker/Receiver Ear jack Table. Audio main component list Description Receiver Voice Call...

  • Page 67: Main Features

    3. TECHNICAL BRIEF 3.12 Main Features 1. LG-U250/KU250 Main features - Bar Type - WCDMA(2100) + GSM Tri-Band (900/1800/1900) - Color LCD (Main:262K TFT, 1.76”) - Dual Camera (1.3Mega + VGA(0.3M)) - 1810 speaker/receiver - Stereo Headset - Speaker phone (in GSM and WCDMA)
  • Page 68 3. TECHNICAL BRIEF 2. U250/KU250 Main Component Logic /Audio Bluetoot Logic Main board (Bottom) Main board (Top) - 69 -...
  • Page 69 3. TECHNICAL BRIEF U101 FL101 U100 X100 Reference Description SW100 Ant. Switch module U500 Front End module U101 GSM PAM FL101 GSM SAW U100 RTR6275 Reference Description FL104 W2100 Duplex U103 WCDMA PAM X100 BT module - 70 - SW100 U500 FL104 U103...
  • Page 70 Logic / Audio BAT300 U303 CN403 CN401 U402 Reference Description BAT300 Backup Battery U303 1.3M Cam. LDO U402 Audio AMP 3. TECHNICAL BRIEF Reference Description CN401 MMI connector (18pin) CN403 1.3M Cam. Connector - 71 -...
  • Page 71 3. TECHNICAL BRIEF Logic U300 J300 Reference Description U201 MSM6245_A U301 Memory MCP CN400 Main To LCD Connector Reference Description U300 J300 U-SIM socket S300 T-FLASH socket - 72 - CN400 U201 U301 S300 PMIC...

  • Page 72: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component - 73 -...
  • Page 73 4. TROUBLE SHOOTING Block Diagram Ref. Name Part Name Function Comment Block UMTS - 74 -...

  • Page 74: Signal Path_Umts Rf

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH_UMTS RF Common Tx/Rx UMTX 2100 Tx/Rx UMTX 2100 Tx UMTX 2100 Rx Tx I/Q RX I/Q - 75 -...

  • Page 75: Signal Path_Gsm Rf

    4. TROUBLE SHOOTING 4.3 SIGNAL PATH_GSM RF Common Tx/Rx GSM900 Tx DCS/PCS Tx EGSM900 RX PCS Rx DCS RX Tx I/Q RX I/Q - 76 -...

  • Page 76: Checking Vc-Tcxo Block

    4.4 Checking VC-TCXO Block The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS TX part, GSM part and BB part. VREG_TCXO_2.85V C185 100p TCXO_PM C187 1000p RTR6275_TCXO Schematic of the VC-TCXO Block Test Point of the VC-TCXO Block 4.
  • Page 77 4. TROUBLE SHOOTING Check C312 of PMIC (U300) Check R213 of MSM (U201) - 78 -...

  • Page 78: Checking Front-End Module Block

    4.5 Checking Front-End Module Block Rev.D L108 VREG_RF_SMPS 15nH C117 Rev.B Schematic of the Front-End Module Block ANT_SEL0 ANT_SEL1 Test Point of the Front-End Module Block 4. TROUBLE SHOOTING Rev.C U500 GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GND1 GSM1900_RX1 GND2 GSM1900_RX2 GND3 WCDMA2100 GND4 GND5...
  • Page 79 4. TROUBLE SHOOTING Logic Table of the FEM GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX TP1 VREG RF SMPS - 80 -...

  • Page 80: Checking Umts Block

    4.6 Checking UMTS Block 4.6.1 Checking Tx level ANT101 ANT102 L101 C437 WCDMA Rev.D L404 1.8nH FL104 PGND C162 3.3p ACMD-7602 0.5p L125 20dB CP0402A1950DNTR R121 For testing, Max power of UMT 2100 is needed. C450 SW100 KMS-507 C102 Rev.D +VPWR C155 C158...
  • Page 81 4. TROUBLE SHOOTING - 82 -...
  • Page 82 4. TROUBLE SHOOTING 4.6.2 Checking UMTS PAM Control Block • PAM control signal 1. PWR_DET : UMTS Tx Power Detected value (Check R120) 2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control 3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V) 4.
  • Page 83 4. TROUBLE SHOOTING 4.6.3 Checking RF Rx Level ANT101 ANT102 C437 WCDMA Rev.D L404 1.8nH FL104 PGND C162 3.3p ACMD-7602 0.5p L125 20dB U102 CP0402A1950DNTR PWR_DET R120 R121 R122 Vbias C450 SW100 KMS-507 C102 L101 +VPWR +VPWR C155 C158 C159 4.7u WS2512_TR1G U103...
  • Page 84 4. TROUBLE SHOOTING - 85 -...

  • Page 85: Checking Gsm Block

    4. TROUBLE SHOOTING 4.7 Checking GSM Block - 86 -...

  • Page 86: Checking Rf Tx Level

    4.7.1 Checking RF Tx level 4.7.2 Schematic of RF Tx level SW100 KMS-507 C102 Rev.D L108 15nH C117 4. TROUBLE SHOOTING C101 L102 100nH Rev.C U500 GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GND1 GSM1900_RX1 GND2 GSM1900_RX2 GND3 WCDMA2100 GND4 GND5 D5011 CTRL1 GND6 CTRL2 GND7...
  • Page 87 4. TROUBLE SHOOTING 4.7.3 Checking RF Tx level - 88 -...

  • Page 88: Checking Pam Block

    4.7.4 Checking PAM Block TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP3. GSM_PA_BAND : Power Amp Band Selection Control (GSM Mode : -0.2V <...

  • Page 89: Checking Rf Rx Block

    4. TROUBLE SHOOTING 4.7.5 Checking RF Rx Block L102 100nH Rev.C U500 GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GND1 GSM1900_RX1 GND2 GSM1900_RX2 GND3 WCDMA2100 GND4 GND5 D5011 CTRL1 GND6 CTRL2 GND7 GND8 GND9 GSM900_TX GND10 GSM18001900_TX C124 100p L115 18nH Schematic of GSM900/DCS/PCS Rx Block TP1.
  • Page 90 4. TROUBLE SHOOTING - 91 -...

  • Page 91: Checking Bluetooth Block

    4. TROUBLE SHOOTING 4.8 Checking Bluetooth Block Test Point of the Bluetooth Block Test Point of the Bluetooth Block C171 BT_CLK C172 C173 R123 VREG_MSMP_2.7V VREG_BT_2.85V Schematic of the Bluetooth Block TP1. VREG_BT_2.85V TP2. VREG_MSMP_2.7V TP3. TCXO_BT TP4. BT ANT Output BLUETOOTH L126 M100...
  • Page 92 Start TP1,TP2 Signals exits? Is clock ok? 19.2M Signals exits? Change the Main board - 93 - 4. TROUBLE SHOOTING Change the Main board Change the X100 Change the M100...

  • Page 93: Power On Troubleshooting

    4. TROUBLE SHOOTING 4.9 Power ON Troubleshooting Power On sequence of U250/KU250 is : PWR key press → PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up → VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V, VREG_TCXO_2.85V power up and system reset assert to MSM6245 → Phone booting and PS_HOLD assert to PMIC Battery voltage.
  • Page 94 4. TROUBLE SHOOTING VREG_MSMC VREG_MSME VREG_MSMP X300 : 32.768Khz R306 : 19.2Mhz VREG_MSMA [U250/KU250 Main PCB BOTTOM] - 95 -...

  • Page 95: Charger Troubleshooting

    4. TROUBLE SHOOTING 4.10 Charger Troubleshooting ICHARGEOUT +VPWR VBATT BATT_FET_N Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT Charging Procedure - Connect TA or USB Cable - Control the charging current by PM6650 IC - Charging current flows into the battery Troubleshooting Setup - Connect TA and battery to the phone Check Point...
  • Page 96 Start Check the pin and battery Connect terminals of I/O connector Connection OK? Is the TA (or USB Cable) voltage 5.1V (or 5.0V)? Is it charging properly After turning on Q301(or Q302) , Q302? Change the board [ Charger Troubleshooting Flow ] - 97 - 4.
  • Page 97 4. TROUBLE SHOOTING Q302 Q300 R313 Q301 [ Charging part ( Main PCB Front ) ] - 98 -...

  • Page 98: Usb Troubleshooting

    4. BB Trouble Shooting 4.11 USB Troubleshooting USB Initial sequence of U250/KU250 is : USB connected to U250/KU250 power on → USB_VBUS(Q300) go to 5V → USB_D+ go to 3.3V → USB_DAT is triggered → USB work. Start Power is on?

  • Page 99: Sim Detect Troubleshooting

    4. TROUBLE SHOOTING 4.12 SIM Detect Troubleshooting USIM Initial sequence of U250/KU250 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 2.8V → USIM IF work Re-insert the SIM card Work well? VREG_UIM_2.85V is 2.85V? USIM_P_CLK is run? Change SIM card...
  • Page 100 USIM USIM_P_DATA L302 56nH Figure. USIM part schematics 4. TROUBLE SHOOTING R317 J300 HSSC-8P-18 GND1 RSV2 RSV1 GND2 GND5 GND3 GND4 - 101 - VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK USIM_P_DATA VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK...

  • Page 101: Camera Troubleshooting

    4. TROUBLE SHOOTING 4.13 Camera Troubleshooting Camera control signals are generated by MSM6245. 4.13.1 MEGA CAMERA Start Check the camera connector and reconnect the camera Camera is OK? Check the CAM_MCLK Change the camera Camera is OK Change the Main board Change the Main board Change the Main board - 102 -...

  • Page 102: Vga Camera

    4.13.2 VGA CAMERA Start Check the camera connector and reconnect the camera Camera is OK? Check the CAM_MCLK Change the camera Camera is OK Change the Main board 4. TROUBLE SHOOTING Change the Main board Change the Main board - 103 -...
  • Page 103 4. TROUBLE SHOOTING C350 C447 U501 U303 +VPWR CAM_LDO_EN C347 +VPWR CAM_LDO_EN C447 C347 C348 C349 CAMERA LDO U303 RT9011-MGPQW VOUT1 VOUT2 C348 VOUT BGND STBY C350 U501 BH15LB1WHFV REV_D - 104 - VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C349 VREG_CAM_DVDD_1.5V...

  • Page 104: Keypad Backlight Troubleshooting

    4.14 Keypad Backlight Troubleshooting Key Pad Back Light is on as below : Key pressing → KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On Start Key press +VPWR is above 3.2V? KYBD_BACKLIGHT is 0V ? Backlight LED ON? Change the Main board +VPWR LD400...

  • Page 105: Main Lcd Troubleshooting

    4. TROUBLE SHOOTING 4.15 Main LCD Troubleshooting Main LCD control signals are generated by MSM6245. The signal path is : MSM6245 → CN400 → LCD Module Start Press END key Key LED is on? Disconnect and reconnect The LCD connector LCD display OK? Change the LCD module LCD display OK?

  • Page 106: Receiver Path

    4.16 Receiver Path MSM6245 EAR1ON/EAR1OP → R421,R422 → Analog Switch(U401) → Receiver Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Can you hear the tone? The sine wave appears at L401, L402? The sine wave appears at R421, R422? Change the Main board 4.
  • Page 107 4. TROUBLE SHOOTING R421 R422 U401 - 108 -...

  • Page 108: Headset Path

    4.17 Headset path MSM6245 HPH_R, HPH_L → C402/C401 → R407/R406 → CN401 (MMI Connector) Start Connect the phone to network equipment and setup call. Setup 1KHz tone out and insert headset. Can you hear the tone? Sine wave appears at R407/R406? Change the Main board 4.
  • Page 109 4. TROUBLE SHOOTING CN401 R406 C401 C402 C407 - 110 -...

  • Page 110: Speaker Phone Path

    4.18 Speaker phone path MSM6245 LINE_P,LINE_N → R429/R427, C423/C422, R431/R426 → Audio AMP(U402) → Analog Switch(U401) → Speaker Start Connect the phone to network equipment and setup call Setup 1KHz tone out Can you hear the tone? Sine wave appears at R429/R427 and C423/C422 And R431/R426 ? SPK_AMP_EN is 2.6V?
  • Page 111 4. TROUBLE SHOOTING Analog Switch SPK+ Audio Amp - 112 -...

  • Page 112: Main Microphone

    4.19 Main microphone MIC400 → MIC1P, MIC1N (MSM6245) Start Make a call MIC_BIAS(C416) is 1.8V Make sound to MIC Sine wave appears at C418/C419? Change the Main board 4. TROUBLE SHOOTING Change main board Change the MIC Work well? - 113 -...
  • Page 113 4. TROUBLE SHOOTING R424 C417 MIC400 - 114 -...

  • Page 114: Headset Microphone

    4.20 Headset microphone Headset → C210/C211 → MIC2P, MIC2N (MSM6245) Start Make a call Change the headset and retry HOOK_KEY is detected? MICBIAS is biased by 1.8V? Sine wave appears at C210/C211 ? Change the Main board 4. TROUBLE SHOOTING Change the MAIN board Change the MAIN board Change the headset or...
  • Page 115 4. TROUBLE SHOOTING Ear_Sense_N MIC Input - 116 -...

  • Page 116: Vibrator

    4.21 Vibrator The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin). The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR. Operate the Vibrator Work well? Change vibrator or PM6650 TP400 TP401 Start L400 56nH D400 RB521S-30...
  • Page 117 4. TROUBLE SHOOTING MOTOR_PWR- +VPWR - 118 -...

  • Page 118: Download

    LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.

  • Page 119: Connecting To Pc

    • The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. U250/KU250 - 120 -...
  • Page 120 3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option. Backup the NV data and restore the backed up NV data automatically. U250/KU250 4) Reset database & Contents: User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased.
  • Page 121 • Select the image folder, where all the image files are located, by clicking on the Browse…. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) U250/KU250 U250/KU250 U250/KU250...
  • Page 122 PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work. (The file name shall be different from that of the file name in the snapshot.) U250/KU250 U250/KU250 U250/KU250...
  • Page 123 NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse… button. U250/KU250 • Click on the START button to start downloading. A summary of the selected images and option information window will be displayed.
  • Page 124 5.1.2.3 Downloading NV_U250/KU250 U250/KU250 U250/KU250 U250/KU250 • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
  • Page 125 5. DOWNLOAD U250/KU250 U250/KU250 • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection. • Rebooting the handset and re-establishing the connection •...
  • Page 126 5. DOWNLOAD • Downloading Media image in progress U250/KU250 • Downloading Module image in progress U250/KU250 • Downloading process has completed U250/KU250 successfully - 127 -...
  • Page 127 5. DOWNLOAD 5.1.2.4 Tools • Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu. - 128 -...

  • Page 128: Troubleshooting Download Errors

    5.1.3 Troubleshooting Download Errors 1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error 5.1.3.1 When the phone does not work • Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS.
  • Page 129 After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode. U250/ K U250 U250/ K U250 U250/ K U250...
  • Page 130 5.1.3.2 NV Restore Error • Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt. U250/KU250 • Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.)
  • Page 131 These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start. U250/KU250 U250/KU250 U250/KU250...

  • Page 132: Caution

    5.1.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) The NV data saved at LGMDP folder as following format. D:\LGMDP\004400-01-429926\_COM14_ LGMDP folder name 4) Recommended that the Module and Media Image have to be downloaded at the same...

  • Page 133: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & UMTS RF Block [Fig 2.1] U250/KU250 RF Functional Block Diagram - 134 -...
  • Page 134 6. BLOCK DIAGRAM [Table 2.1] RF Block Component - 135 -...

  • Page 135: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram 6.2.1 RTR6275 & MSM6245 Interface Diagram [Fig 2.2] RTR6275 & MSM6245 Interface Diagram - 136 -...
  • Page 136 6. BLOCK DIAGRAM 6.2.2 Memory Interface ADDRESS[14:0] [Fig 2.3] Memory Interface Diagram - 137 -...
  • Page 137 6. BLOCK DIAGRAM 6.2.3 USB,UART,SIM,JTAG Interface [Fig 2.4] USB, UART, SIM, JTAG Interface - 138 -...
  • Page 138 Main RF signal Control signal Control signal UMTS PA_CTL signal PA_R0 GSM PA_CTL signal GSM_PA_BAND GSM_PA_EN GSM_PA_RAMP ANT_SEL 0,1 Description UMTS Tx High/Low Power Control DCS or PCS /GSM Mode Selection Power Amp Gain Control Enable Power Amp Gain Control Ant Switch Module Mode Selection - 139 - 6.
  • Page 139 6. BLOCK DIAGRAM 6.2.4 Placement *Top Side - 140 -...
  • Page 140 6. BLOCK DIAGRAM *Bottom Side - 141 -...
  • Page 141 - 142 -...

  • Page 142: Circuit Diagram

    R123 VREG_MSMP_2.7V VDD_MSM RX_BB_TX_BB BT_DATA VREG_BT_2.85V VDD_BAT XTAL_IN TCXO_BT 1000p C176 Section Date Sign & Name Sheet/ Sheets KU250 U250/KU250 KANG. H. S MODEL Designer MAR. 07. 2007 Checked DRAWING Approved DRAWING LG Electronics Inc. REV_1.2 LG Electronics Inc. LGMC...
  • Page 143 Section Date Sign & Name U250/KU250 KU250 Jaykay MODEL MAR.07.2007 Designer UTXD URXD Checked TP402 VBAT VBAT TP403 ON_SW ON_SW DRAWING UFLS TP404 TP405 NAME Approved TP406 2.5G UART DRAWING REV_1.0 LG Electronics Inc. LG Electronics Inc. LGMC Sheet/ Sheets...
  • Page 144 Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT Section Date Sign & Name Sheet/ KU250 Sheets U250/KU250 Jaykay MODEL Designer MAR.07.2007 WLED_1 WLED_2 Checked WLED_3 MEM & POWER DRAWING NAME Approved DRAWING LG Electronics Inc. REV_1.0 LG Electronics Inc. LGMC...
  • Page 145 MENU LEFT RIGHT SEARCH HOT400 HOT401 BACK HOT4 HOT3 KEYS Section Date Sign & Name Sheet/ KU250 Sheets U250/KU250 MAR.07.2007 Jaykay MODEL Designer Checked KEY / MMI DRAWING NAME Approved LCD/CAMERA DRAWING LG Electronics Inc. REV_1.2 LG Electronics Inc. LGMC...

  • Page 146: Pcb Layout

    8. PCB LAYOUT LGMC - 147 -...
  • Page 147 8. PCB LAYOUT LGMC - 148 -...

  • Page 148: Calibration & Rf Auto Test Program (Hot Kimchi)

    9. Calibration & RF Auto Test Program (Hot Kimchi) 9. Calibration & RF Auto Test Program (Hot Kimchi) 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory Cm_Grut : Directory : File Common dll_serialat At_Serial_Cmd.xml Diag_NV6250_RevB.dll Diag_NV6275.dll Diag_NV.dll DLL_E5515CD.DLL DLL_PwrControlD.dll Dll_SerialATD.dll LG_CL_011.dll PwrSupply_Cmd.xml...
  • Page 149 9. Calibration & RF Auto Test Program (Hot Kimchi) : Directory : File Hot_Kimchi Debug image ComLMPLib_11.dll Dll_EzLooksMQ_004.dll GuiTk115d.dll HK_25.exe ijl11.dll SBCmd.xml ShieldBox_DllD.dll Model KU250 LG_RfTest_E5515C_211.dll QMSL_MSVC6R.dll - 150 - AutoSetup_110.xml Cal_Setup_Test.xml Ezlooks.xml LG_RfCal_Q3G6280N_Polar_006.dll Procedure_KU250_103.xml script_auto_001.xml script_cal_003.xml Spec_3GPP_030.xml...
  • Page 150 9. Calibration & RF Auto Test Program (Hot Kimchi) dll,ocx Result : Directory : File _New_HK_0808.reg (Win98)MFCD DLL COPY.bat (Win2000)MFCD DLL COPY.bat (WinXP)MFCD DLL COPY.bat MFC42D.DLL MFCD42D.DLL MFCN42D.DLL MFCO42D.DLL MSVCP60D.DLL MSVCRTD.DLL Vsflex7L.ocx vsflex7l_ocx_regist.bat Auto CalAuto image LG_UI_Ad6500_002.dll LG_UI_EmKU250_001.dll LG_UI_Qu6250_003.dll LG_UI_Qu6275_004.dll - 151 - KU250 KU250...

  • Page 151: How To Use Hot Kimchi

    9. Calibration & RF Auto Test Program (Hot Kimchi) 9.2 How to use HOT KIMCHI ➀ ➁ ➂ * Procedure 1. Click “Logic Operation” of “SETTING” menu bar 2. Select “UART Port” that PC can communicate with the phone 3. Select “LOGIC MODE” that you want - Logic Mode ->...
  • Page 152 9. Calibration & RF Auto Test Program (Hot Kimchi) KU250 ➄ Click "Start" ➃ Select "U250/KU250" * Procedure 4. Select the model name “U250/KU250” 5. Click “Start” button - 153 -...

  • Page 153: Factory Test Mode

    10. Factory Test Mode 10. Factory Test Mode 10.1. Test Program Setting 1) Open “LG FTM GUI” 2) Click “Options >> Port Settings” 3) Select Com Port and click “OK” - 154 -...

  • Page 154: Wcdma Test Mode

    10.2. WCDMA Test Mode 1) Click “Tools >> FTM GUI WCDMA” 2) Select “FTM” Mode 3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then “2140” is written at Rx UHF automatically. 4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA Power is decided.

  • Page 155: Gsm Test Mode

    10. Factory Test Mode 10.3. GSM Test Mode 1) To switch GSM Mode, Select Mode -> GSM mode at menu commands 2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900” 3) Write wanted channel. We usually set “1” 4) For Deciding to “PA DAC Value”, insert 14300 as a maximum value 5) Click “Tx On”...

  • Page 156: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW 29 30 24 25 - 157 -...
  • Page 157 - 158 -...

  • Page 158: Replacement Parts

    SBOM standard on GCSC Part Number Spec TIMT0000614 AAAY0219401 MCJA0040601 MOLD, PC LUPOY SC-1004A, , , , , APAY0095904 U250 HIT Packing(P/Label66-Angle-9501) BSEA0003901 PACKING-LIST ENVELOPE APEY0394202 ACGK0085601 MCCC0043601 COMPLEX, (empty), , , , , MCCG0007601 COMPLEX, (empty), , , , ,...
  • Page 159 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description MTAB01 TAPE,PROTECTION MTAD00 TAPE,WINDOW MWAE00 WINDOW,CAMERA SJMY00 VIBRATOR,MOTOR SNGF00 ANTENNA,GSM,FIXED MLAA00 LABEL,APPROVAL MCBA00 CAN,SHIELD MPBZ00 ADCA00 DOME ASSY,METAL MTAZ00 TAPE MLAZ00 LABEL Part Number Spec MTAB0178301 COMPLEX, (empty), , , , , MTAD0065901 COMPLEX, (empty), 0.2, , , , MWAE0024501...

  • Page 160: Main Component

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts <Main component> Location Level Description GMEY00 SCREW MACHINE,BIND SAFY00 PCB ASSY,MAIN SAFB00 PCB ASSY,MAIN,INSERT ACKA00 CAN ASSY,SHIELD SUMY00 MICROPHONE SUSY00 SPEAKER SVCY00 CAMERA SVCY01 CAMERA SVLM00 LCD MODULE SAFF00 PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT SAFC00 BOTTOM...
  • Page 161 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description C123 CAP,CERAMIC,CHIP C124 CAP,CHIP,MAKER C126 CAP,CERAMIC,CHIP C127 CAP,CERAMIC,CHIP C128 CAP,CERAMIC,CHIP C129 CAP,CERAMIC,CHIP C130 CAP,CERAMIC,CHIP C131 CAP,CERAMIC,CHIP C132 CAP,CERAMIC,CHIP C134 CAP,CERAMIC,CHIP C135 CAP,CERAMIC,CHIP C136 CAP,CERAMIC,CHIP C139 CAP,CHIP,MAKER C140 CAP,CERAMIC,CHIP C141 CAP,CERAMIC,CHIP C142 CAP,CHIP,MAKER C143...
  • Page 162 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description C173 CAP,CERAMIC,CHIP C174 CAP,CERAMIC,CHIP C176 CAP,CERAMIC,CHIP C177 CAP,CHIP,MAKER C178 CAP,CHIP,MAKER C179 CAP,CHIP,MAKER C180 CAP,CERAMIC,CHIP C181 CAP,CERAMIC,CHIP C182 CAP,CERAMIC,CHIP C183 CAP,CERAMIC,CHIP C185 CAP,CHIP,MAKER C186 CAP,CERAMIC,CHIP C187 CAP,CERAMIC,CHIP C188 CAP,CERAMIC,CHIP C189 CAP,CERAMIC,CHIP C190 CAP,CERAMIC,CHIP C192...
  • Page 163 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description C222 CAP,CERAMIC,CHIP C223 CAP,CERAMIC,CHIP C225 CAP,CERAMIC,CHIP C226 CAP,CERAMIC,CHIP C227 CAP,CERAMIC,CHIP C228 CAP,CERAMIC,CHIP C229 CAP,CHIP,MAKER C230 CAP,CHIP,MAKER C231 CAP,CERAMIC,CHIP C232 CAP,CERAMIC,CHIP C233 CAP,CERAMIC,CHIP C234 CAP,CERAMIC,CHIP C235 CAP,CERAMIC,CHIP C236 CAP,CERAMIC,CHIP C237 CAP,CERAMIC,CHIP C238 CAP,CERAMIC,CHIP C239...
  • Page 164 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description C319 CAP,CHIP,MAKER C320 CAP,CHIP,MAKER C321 CAP,CHIP,MAKER C322 CAP,CERAMIC,CHIP C323 CAP,CERAMIC,CHIP C324 CAP,CHIP,MAKER C325 CAP,CERAMIC,CHIP C326 CAP,CERAMIC,CHIP C327 CAP,CERAMIC,CHIP C328 CAP,CHIP,MAKER C329 CAP,CHIP,MAKER C330 CAP,CHIP,MAKER C331 CAP,CHIP,MAKER C332 CAP,CHIP,MAKER C333 CAP,CERAMIC,CHIP C334 CAP,CERAMIC,CHIP C335...
  • Page 165 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description C357 CAP,CHIP,MAKER C358 CAP,CERAMIC,CHIP C389 CAP,CERAMIC,CHIP C400 CAP,CERAMIC,CHIP C401 CAP,TANTAL,CHIP C402 CAP,TANTAL,CHIP C403 CAP,CERAMIC,CHIP C404 CAP,CHIP,MAKER C405 CAP,CERAMIC,CHIP C406 CAP,CHIP,MAKER C407 CAP,CERAMIC,CHIP C408 CAP,CERAMIC,CHIP C409 CAP,CERAMIC,CHIP C410 CAP,CERAMIC,CHIP C411 CAP,CHIP,MAKER C412 CAP,CERAMIC,CHIP C413...
  • Page 166 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description C436 CAP,CERAMIC,CHIP C437 CAP,CHIP,MAKER C438 CAP,CHIP,MAKER C439 CAP,CHIP,MAKER C440 CAP,CHIP,MAKER C441 CAP,CERAMIC,CHIP C442 CAP,CERAMIC,CHIP C443 CAP,CERAMIC,CHIP C444 CAP,CERAMIC,CHIP C445 CAP,CERAMIC,CHIP C446 CAP,TANTAL,CHIP,MAKER C447 CAP,CHIP,MAKER C450 CAP,CERAMIC,CHIP CN400 CONNECTOR,FFC/FPC CN401 CONNECTOR,I/O CN403 CONN,SOCKET D400...
  • Page 167 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description FL405 FILTER,EMI/POWER FL406 FILTER,EMI/POWER FL407 FILTER,EMI/POWER FL408 FILTER,EMI/POWER J300 CONN,SOCKET L102 INDUCTOR,CHIP L108 INDUCTOR,CHIP L111 INDUCTOR,CHIP L114 INDUCTOR,CHIP L115 INDUCTOR,CHIP L116 INDUCTOR,CHIP L119 INDUCTOR,CHIP L120 INDUCTOR,CHIP L121 INDUCTOR,CHIP L123 INDUCTOR,CHIP L125 INDUCTOR,CHIP L128...
  • Page 168 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Q301 TR,FET,P-CHANNEL Q302 TR,BJT,PNP R100 RES,CHIP,MAKER R101 RES,CHIP,MAKER R103 RES,CHIP,MAKER R104 RES,CHIP,MAKER R105 RES,CHIP,MAKER R106 RES,CHIP,MAKER R107 RES,CHIP R108 RES,CHIP,MAKER R109 RES,CHIP,MAKER R110 RES,CHIP,MAKER R111 RES,CHIP,MAKER R112 RES,CHIP,MAKER R113 RES,CHIP R114 RES,CHIP R115...
  • Page 169 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description R214 RES,CHIP,MAKER R215 RES,CHIP,MAKER R300 RES,CHIP,MAKER R301 RES,CHIP,MAKER R302 RES,CHIP,MAKER R303 RES,CHIP,MAKER R304 RES,CHIP,MAKER R305 RES,CHIP,MAKER R306 RES,CHIP,MAKER R307 RES,CHIP,MAKER R308 RES,CHIP,MAKER R309 RES,CHIP,MAKER R313 RES,CHIP R314 RES,CHIP,MAKER R315 RES,CHIP,MAKER R316 RES,CHIP,MAKER R317...
  • Page 170 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description R429 RES,CHIP,MAKER R430 RES,CHIP,MAKER R431 RES,CHIP,MAKER R433 RES,CHIP R434 RES,CHIP R435 RES,CHIP,MAKER R436 RES,CHIP,MAKER R437 RES,CHIP,MAKER RA400 RES,ARRAY,R S300 CONN,SOCKET SW100 CONN,RF SWITCH TR100 TR,BJT,ARRAY U100 U101 COUPLER,RF U102 DIRECTIONAL U103 U104 U201...
  • Page 171 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description VA302 VARISTOR VA303 VARISTOR VA304 VARISTOR VA305 VARISTOR VA306 VARISTOR VA400 VARISTOR VA401 VARISTOR VA402 VARISTOR VA403 VARISTOR VA404 VARISTOR VA405 VARISTOR VA407 VARISTOR VA408 VARISTOR VA409 VARISTOR VA410 VARISTOR VA412 VARISTOR VA414...
  • Page 172 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description R417 RES,CHIP R418 RES,CHIP R419 RES,CHIP R423 RES,CHIP,MAKER SPFY00 PCB,MAIN Part Number Spec ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP SPFY0147601...

  • Page 173: Accessory

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.3 Accessory Location Level Description BATTERY PACK,LI-ION SBPL00 ADAPTOR,AC-DC SSAD00 ADAPTOR,AC-DC ADAPTOR,AC-DC ADAPTOR,AC-DC Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Part Number Spec 3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe BATT, IP, Pb-Free ,;...
  • Page 174 Note...
  • Page 175 Note...

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