HCD-GT111/GT222/GT444/GT555
Q Q
3 7 6 3 1 5 1 5 0
7-19. PRINTED WIRING BOARDS - JACK Section -
• See page 27 for Circuit Boards Location.
1
2
MIC BOARD
A
C718
C716
R712
RV700
C713
C722
MIC
R706
LEVEL
R714
C712
C707
IC700
R705
B
C701
R704
JW701
J700
MIC
C702
C711
R702
C710
C720
C
R715
C721
R716
MAIN
A
BOARD
R719
CN470
(Page 35)
T E
L
1 3 9 4 2 2 9 6 5 1 3
R722
D
R720
R721
R723
MAIN
J
BOARD
CN488
(Page 35)
JW708
NO702
(CHASSIS)
E
JW707
D701
R
J701
R710
F
AUDIO
INPUT
FB700
R709
L
G
w w w
J702
PHONES
C717
H
D702
13
1-875-674-
(13)
HCD-GT111/GT222/GT444/GT555
•
: Uses unleaded solder.
3
4
5
JK890
SW JACK BOARD
SUB WOOFER
D890
C836
R880
R873
1
6
11
CN890
R876
R870
(11)
Q
(Page 41)
POWERAMP
NO800
(GT444/GT555)
x
a o
y
.
i
http://www.xiaoyu163.com
8
7-20. SCHEMATIC DIAGRAM - JACK Section -
1
2
J700
A
MIC
MIC BOARD
C700
B
R700
1k
C702
1000p
R702
C
R704
10k
C707
2.2
50V
C708
1000p
R701
100k
C709
R706
220p
1.5k
C713
C711
C719
2.2
330p
50V
6.3V
D
IC700
3
2
MIC AMP
+
-
C701
0.1
R712
1
Q
Q
18k
C710 10
16V
3
7
6
3
4.5
IC700(3/3)
NJM4558V-TE2
C721
C718
9
POWER
0.1
50V
GND
4
8
E
R716
100k
1
RV700
R718
R713
50k
18k
100
MIC LEVEL
F
R720
100k
(GT444/GT555)
SW JACK BOARD
G
C836
0.1
C841
0.1
R880
10
H
CN890
6P
SW-SP_GND
1
Q
SW-SP_GND
2
SW OUT
3
POWERAMP
SW OUT
4
BOARD
(2/2)
I
RLY+
5
NO800
(Page 43)
RLY-
6
u 1 6 3
.
40
40
2
4
9
9
8
3
4
5
J701
AUDIO
INPUT
J702
L
R
PHONES
L
R
D702
MC2837
0.1
R709
1k
C703
0.1
D701
R707
R708
220k
220k
MC2837
C704
C714
C715
1000p
1000p
1000p
R722
10k
R705
4.7k
4.7k
C717
1000p
C705
0.1
C716
C712
2.2
R711
47p
50V
10k
R721
47k
100
4.4
5
6
-
+
R714
C722
220k
180p
7
4.4
C720
1
5
1
2.2
5
0
8
9
2
4
50V
R715
100
0.1
R719
10k
RY890
L890
JK890
1.7uH
+
SUBWOOFER
R893
R894
10
10
-
R892
R891
10
10
D890
MA2J1110GLS0
m
c o
2
9
9
6
7
NO702
(CHASSIS)
NO701
4P
TP714
J
4
CHASSIS
TP713
3
HP-R
TP712
MAIN
2
HP GND
BOARD
TP711
(3/4)
1
HP-L
CN488
(Page 38)
9
8
2
9
9
NO700
8P
TP700
1
A+9V
TP701
2
MIC SIGNAL
TP702
A
3
MIC GND
TP703
4
AUX-L
TP704
MAIN
5
AGND
BOARD
TP705
(1/4)
6
AUX-R
CN470
TP706
7
AGND
(Page 36)
TP707
8
HP/MIC DET