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M-540V
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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TABLE OF CONTENTS
1. GENERAL ....................................................................
2-1. Lid Assy, Cassette ........................................................... 4
2-2. Lid, Battery Case ............................................................ 5
2-3. Cabinet (Rear) Assy ........................................................ 5
2-4. Main Board ..................................................................... 6
2-5. Mechanism Deck ............................................................ 6
2-6. Head, Ceramic (HRPE901) ............................................ 7
3. MECHANICAL ADJUSTMENTS ..............................
4. ELECTRICAL ADJUSTMENTS ...............................
5-1. Block Diagram .............................................................. 11
5-2. Printed Wiring Board .................................................... 12
5-3. Schematic Diagram ....................................................... 13
6-1. Cabinet Section ............................................................. 14
6-2. Mechanism Deck Section ............................................. 14
7. ELECTRICAL PARTS LIST .....................................
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15
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
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