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LG U8550 Service Manual
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LG U8550 Service Manual

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Service Manual
U8550
Date: November, 2005 / Issue 1.0

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Summary of Contents for LG U8550

  • Page 1 Service Manual U8550 Date: November, 2005 / Issue 1.0...

  • Page 2: Table Of Contents

    Table of Contents 1. INTRODUCTION ......6 3.2.2 Block Description ......44 3.2.3 Camera & Camera FPC Interface... 46 1.1 Purpose........... 6 3.2.4 Camera Regulator ......49 1.2 Regulatory Information......6 3.2.5 Display & LCD FPC Interface ..50 1.3 Abbreviations .......... 8 3.2.6 Main&Sub LCD Backlight Illumination...52 3.2.7 Camera Flash LED Illumination ..
  • Page 3 Table Of Contents 3.8.3 Frequency Generation .....92 4.20.1 Checking VCXO Block ....154 4.20.2 Checking Ant. SW module ...154 4. TROUBLE SHOOTING ....94 4.20.3 Checking Control Signal ....154 4.20.4 Checking RF TX Level ....156 4.1 Power ON Trouble .........94 4.20.5 Checking PAM Block ....159 4.2 USB Trouble ..........96 4.20.6 Checking RX I,Q ......162 4.3 SIM Detect Trouble ........97...
  • Page 4 Table Of Contents 7.3.5 WCDMA Calibration Items .... 210 7.3.6 Baseband Calibration Item ... 218 7.4 Program Operation ......219 7.4.1 XCALMON Program Overview ..219 7.4.2 XCALMON Icon Description ..220 7.4.3 Calibration Procedure ....223 7.4.4 Calibration Result Message ..225 8.

  • Page 5: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 6 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 7: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purpose of this manual, following abbreviations apply. Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing DeskTop Charger EEPROM...
  • Page 8 1. INTRODUCTION I. Introduction 1.3 Abbreviations For the purpose of this manual, following abbreviations apply. PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory UMTS...

  • Page 9: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 & WCDMA Folder- Dual Mode Handset Size 90 x 55 x 24.7mm Weight 134g (with Standard Battery) Power 1400mA Li-Polymer Over 180 Min (WCDMA, Tx=12 dBm, Voice) Talk Time Over 220 Min (GSM, Tx=Max, Voice) Over 165 hrs (WCDMA, DRX=1.28) Standby Time...

  • Page 10: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Spec. Unit Voltage 4.0 (Typ), 3.4 (Min), (Shut Down: 3.2) Operating Temp. -20 ~ + 60 °C Storage Temp. -30 ~ + 85 °C Humidity max. 85 2) Environment(Accessory) Item Spec. Typ. Unit Power Available power...
  • Page 11 2. PERFORMANCE Item DCS/PCS 30M ~ 1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G ~ 1710MHz -30dBm Channel 1710M ~ 1785MHz -36dBm 1G ~ 4GHz -30dBm Radiated 1785M ~ 4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm Emission 880M ~ 915MHz...
  • Page 12 2. PERFORMANCE Item DCS/PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3 ±3 ±3...
  • Page 13 2. PERFORMANCE 2) Transmitter-WCDMA Mode Item Specification Class3: +24dBm(+1/-3dB) Maximum Output Power Class4: +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 14 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1k BW -36dBm@f=150KHz~30MHz, 10k -36dBm@f=30~1000MHz, 100k Spurious Emissions -30dBm@f=1~12.75GHz, 1M *: additional requirement -41dBm*@1893.5~1919.6MHz, 300k -67dBm*@925~935MHz, 100k -79dBm*@935~960MHz, 100k -71dBm*@1805~1880MHz, 100k -31dBc@5MHz, Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5% (>-20dBm) Error Vector Magnitude(EVM) (@12.2k, 1DPDCH+1DPCCH)
  • Page 15 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensivitivity Level -106.7dBm(3.84M) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(class3) 33dB Adjacent Channel Selectivity(ACS) UE@+20dBm output power(class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(class3) -44dBm/3.84MHz@f=2050~2095 & 2185~2230MHz, band a) UE@+20dBm output power(class3) -30dBm/3.84MHz@f=2025~2050 &...
  • Page 16 2. PERFORMANCE 5) Bluetooth Mode 5.1) Transmitter Out Power Class 2 : -6~4dBm Power Density Power density < 20dBm per 100kHz EIRP Option Power Control 2dB ≤ step size ≤ 8dB TX Output Spectrum fmax & fmin @ below the level of -30dBm(100khz BW) -Frequency range within 2.4GHz~2.4835GHz TX Output Spectrum...
  • Page 17 2. PERFORMANCE 5.2) Receiver Sensitivity single slot packets BER≤0.1%@-70dBm Sensitivity multi slot packets BER≤0.1%@-70dBm BER ≤ 0.1%@ (Low,Mid,High Frequency) 2405MHz, 2441MHz, 2477MHz Interference Ratio Co-Channel interference, C/I co-channel 11dB C/I performance Adjacent(1MHz)interference, C/I 1MHz Adjacent(2MHz)interference, C/I 2MHz -30dB Adjacent(≥3MHz)interference, C/I ≥3MHz -40dB Adjacent(≥3MHz)interference to in band -9dB...

  • Page 18: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption (VT test : Speaker off, LCD backlight On) Stand by Voice Call WCDMA 165Hours=8.48mA 180Min=467mA 130Min=646mA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) 223Hours=6.28mA 220Min=380mA (paging=9period) (Tx=Max) 2.5 RSSI WCDMA(TBD) BAR 4 → 3 -91 ±2dBm -87 ±2dBm BAR 3 → 2 -96 ±2dBm -97 ±2dBm BAR 2 →...

  • Page 19: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8±3dB -1±3dB Receiving Loudness Rating (RLR) -15±3dB Side Tone Masking Rating (STMR) 17dB over Echo Loss (EL) 40dB over Sending Distortion (SD) refer to TABLE 30.3 Receiving Distortion (RD) refer to TABLE 30.4 Idle Noise-Sending (INS) -64dBm0p under...

  • Page 20: Charging

    2. PERFORMANCE 2.8 Charging • Normal mode: Complete Voltage: 4.2V Charging Current: 800mA • Await mode: In case of During a Call, should be kept 3.9V (GSM: It should be kept 3.9V in all power level WCDMA: It will not be kept 3.9V in some power level) •...

  • Page 21: Technical Brief

    3. Technical Brief 3. Technical Brief 3.1 Digital Baseband(DBB) & Multimedia Processor 3.1.1 General Description A. Features • CPU ARM946 running at 104 MHz - 32 kB Instruction Cache, 16 kB Data Cache, 128 kB Instruction TCM and 128 kB Data TCM - 8 channel DMAC •...

  • Page 22: Hardware Architecture

    3. Technical Brief 3.1.2 Hardware Architecture The hardware structure is delivered as five separate hardware macros to the top-level design, also depicted in Figure. GAM Subsystem CPU Subsystem Peripheral Subsystem GSM Core Subsystem DPS Subsystem SYSCON Figure 3-1-1 Simplified Block Diagram of Ericsson DB 2000 - 23 -...
  • Page 23 3. Technical Brief A. Block Diagram GAM Sub-System CPU Sub-Chip CPU Sub-System PDID [7:0] data data Slave GRAPHCON Instruction Data Boot ROM PDIC [4:0] ETM IF SRAM 16k bytes PDIRES_N 128kB 128kB (4K x 32bit) GRAM RAM Control System 160k byte BRAM CID [7:0] CIPCLK...
  • Page 24 3. Technical Brief B. CPU Hardware Subsystem The CPU subsystem incorporates: • CPU Sub chip • Backplane • JTAG • DMA Controller • System Buffer RAM • Boot ROM • External Memory Interface (EMIF) for connection to external SRAM and Flash memories. The bus architecture is built on the ARM AMBA standard with multi-layer AHB (Advanced High-speed Bus) and APB (Advanced Peripheral Bus) for the peripheral buses.
  • Page 25 3. Technical Brief F. GSM Hardware Subsystem The GSM subsystem is a stand-alone sub-chip incorporating GSM modem and interface to GSM radio together with memory control (MEMSYS) and internal RAM (IRAM). The hardware peripheral blocks are RXIF, FCHDET, CRYPTO, EQU, NODI, 4 x CHD, GPRS CRYPTO, GPRS CRC24, CHE, DIRMOD, CLKCON, SERCON, TIMGEN, MEMSYS and IRAM.

  • Page 26: External Memory Interface

    90 ns at 54MHz RD38F4455LLYBQ1 Intel 10 ns PSRAM 85 ns 25 ns 85 ns at 66MHz Table 3-1-1. External Memory Interface Spec. of U8550 Flash 256 Mb (Top boot) Flash 256 Mb (Bottom boot) PSRAM 64 Mb PSRAM 64 Mb...

  • Page 27: Rf Interface

    3. Technical Brief 3.1.4 RF Interface A. MARITA Interface Marita controls GSM RF part using these signals through GSM RF chip-Ingela. • RFCLK, RFDAT, RFSTR : Control signals for Ingela • TXON, RXON : Control signals for TX and RX part of Ingela •...
  • Page 28 3. Technical Brief B. WANDA Interface Wanda controls WCDMA RF part using these signals through W-CDMA RF chip-Wopy & Wivi. • WCLK, WDAT, WSTR : Control signals for Wivi & Wopy • RXIA, RXIB, RXQA, RXQB : WCDMA RX Data •...

  • Page 29: Sim Interface

    3. Technical Brief 3.1.5 SIM Interface SIM interface scheme is shown in Figure 3-1-6 SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(MARITA) with ABB(VINCENNE) and filter. SIM (Interface between DBB and ABB) SIMDATO SIM card bidirectional data line SIMCLKO SIM card reference clock SIMRSTO SIM card async/sync reset...

  • Page 30: Uart Interface

    3. Technical Brief 3.1.6 UART Interface UART signals are connected to MARITA GPIO through IO connector and Bluetooth interface. UART0 Resource Name Note GPIO10 UARTRX0 Receive Data GPIO11 UARTTX0 Transmit Data UART3 for the bluetooth GPIO24 UARTRX3 Receive Data GPIO25 UARTTX3 Transmit Data GPIO26...

  • Page 31: Gpio (General Purpose Input/Output) Map

    3. Technical Brief 3.1.7 GPIO (General Purpose Input/Output) map In total 40 allowable resources. This model is using 22 resources. GPIO Map, describing application, I/O state, and enable level are shown in below table 3-1-4. IO # Application Resource Inactive State Active State GPIO00 VGA_IO_OFF...

  • Page 32: Usb

    3. Technical Brief 3.1.8 USB The USB block supports the implementation of a "full-speed" device fully compliant to USB 2.0 standard. It provides an interface between the CPU (embedded local host) and the USB wire, and handles USB transactions with minimal CPU intervention. The USB specification allows up to 15 pairs of endpoints.
  • Page 33 3. Technical Brief USBDP USBDP USBDM USBDM USBPUEN USBPUEN Figure 3-1-8. Schematic of MARITA USB block VBUS USBPUEN NUF2221W1T2 USBDM 3_3V USBDP L701 USB FILTER Figure 3-1-9. Schematic of USB filter - 34 -...

  • Page 34: Folder On/Off Detection

    3. Technical Brief 3.1.9 Folder ON/OFF Detection There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch(U1 on Keypad), the voltage at Pin 1 of U1 goes to 0V. Otherwise 2.8V.

  • Page 35: Bluetooth Interface

    3. Technical Brief 3.1.10 Bluetooth Interface U8550 supports Bluetooth operation using Philips’ BGB202/S2 Bluetooth module. A. General Description The Bluetooth interface utilizes the UART interface for control signals going to and from the Bluetooth module. The UART is also used for data transmissions. It uses the PCM interface for transmitting audio to and from the Bluetooth module.
  • Page 36 3. Technical Brief F. BGB202/S2 • General - Full module (BB+RF) : Only need to external antenna and reference clock - Bluetooth Specification version 1.1 - Dimensions : 7 x 8 x 1.3 mm - Power class 2 : 10m •...
  • Page 37 3. Technical Brief G. U8550 Bluetooth Schematic U604 BGB202_S2 R650 CLKREQ GPIO10 GP_CLK REF_CLK R651 RESOUT2n RESET_N TCK_JTAG TMS_JTAG TDI_JTAG UARTRTS3 GPIO2_CTS_UART TDO_JTAG UARTCTS3 GPIO3_RTS_UART UARTRX3 GPIO4_TXD_UART GPIO0 UARTTX3 GPIO5_RXD_UART GPIO1 PCMDATB GPIO6_DA_IP C647 R656 33p L602 PCMSYN GPIO7_FSC_IP FEED...

  • Page 38: Transflash Interface

    3. Technical Brief 3.1.11 TransFlash Interface U8550 supports the TransFlash interface as external memory card. TransFlash has 4-data line, but U8550 uses only 1-data line. All control and data line is connected to MARITA TransFlash Interface TF_DETECT Card detection, connected to GPIO37 of MARITA...

  • Page 39: Power On Sequence

    3. Technical Brief 3.1.12 Power On Sequence ➀ User presses END key and then ONSWAn signal is changed to Low. ➁ VINCENNE initiates the internal oscillator and powers on the regulators. ➂ VINCENNE generates a power for MARITA. ➃ VINCENNE releases the power reset signal(PWRRSTn) and generates an interrupt(IRQ0n) to MARITA.

  • Page 40: Keypad

    3. Technical Brief 3.1.13 Keypad There are 26 buttons, 3 side keys and 3 MOD keys. ‘END’ key is connected to ONSWAn for Vincenne. KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYOUT0 SIDE1 SIDE2 SIDE3 KEYOUT1 MENU SEARCH MULTI KEYOUT2 KEYOUT3 DOWN KEYOUT4 RIGHT KEYOUT5...
  • Page 41 3. Technical Brief KEYIN1 KEYIN2 KEYIN3 RIGHT CENTER LEFT Table 3-1-8. MOD Key Matrix Mapping Table DCIN_3 KEYIN1 KEYIN2 KEYIN3 CPO_LTC_LCDBL LEFT CENTER RIGHT Figure 3-1-15. Schematic of MOD Keypad - 42 -...

  • Page 42: Gam Hardware Subsystem

    3. Technical Brief 3.2 GAM Hardware Subsystem PDID [7:0] Display GRAPHCON PDI/SSI Module PDIC [4:0] control PDIRES_N CIRES_N GRAM GAMCON 160k byte CID [7:0] Camera CIPCLK Module CIVSYNC AHB Slave AHB Slave CIHSYNC AHB2 (DMA) AHB1 (CPU) Figure 3-2-1. GAM Subsystem Functional Block Diagram 3.2.1 General Description The Graphics Accelerator Module (GAM) subsystem provides hardware support in the creation of visual imagery and the transfer of this data to the display.

  • Page 43: Block Description

    3. Technical Brief 3.2.2 Block Description A. GAM Controller(GAMCON) The GAM Controller (GAMCON) is responsible for clock gating and distribution within the GAM module. GAMCON receives the HCLK from SYSCON and distributes to GRAPHCON, GRAM, PDI and CDI. GAMCON also distributes the GAM reset signal to GRAPHCON, GRAM, PDI and CDI. The reset signals CIRES_N and PDIRES_N are distributed from GAMCON to the camera and display module respectively, see Figure 2.28.
  • Page 44 3. Technical Brief E. Camera Data Interface (CDI) Block The camera data interface (CDI) block is designed to support a range of still image camera modules. An 8-bit parallel bus supports data transfer from the camera module to the CDI. The pixel clock is an output clock from the camera module to the CDI and qualifies the data on the parallel bus.

  • Page 45: Camera & Camera Fpc Interface

    3. Technical Brief 3.2.3 Camera & Camera FPC Interface PDIRES_N LCDRESX VCORE VDIG PDIC0 LCDCSX_SUB LCD I/F PDIC1 LCDWRX PDIC2 LCDRS PDIC3 LCDCSX_MAIN R609 R601 LCDRDX PDIC4 PDID0 PDID0 VDIG 4.7K VDIG 3.3K PDID1 PDID1 PDID2 PDID2 PDID3 PDID3 I2CCLK Q601 PDID4 PDID4...
  • Page 46 3. Technical Brief EDLM0005801 FLASH3 FLASH2 CIRES_1.3M FLASH1 I2C_CLK CPO_LTC_FLASH I2C_DAT CID0 CID1 SYSCLK CID2 CIVSYNC CID3 CIHSYNC CID4 CID5 CID6 CID7 CIPCLK MAIN-to-FPCB Connector I2C_CLK CID7 I2C_DAT CID6 CID5 CIVSYNC CID4 CIHSYNC CID3 SYSCLK CID2 CID1 CID0 CIPCLK CIRES_1.3M FPCB-to-1.3M Connector Figure 3-2-4.
  • Page 47 The 1.3M Camera module is connected to main board(AXK7L26227) with Camera FPCB (AXK8L26125). The VGA Camera module is connected to main board(AXK7L50227) with Camera & LCD FPCB(AXK8L50125). 1.3M Camera module is connected to FPCB with 24-pin Board to Board connector(14-5602-024-000-829 - 1.3M Camera). VGA Camera module is connected to FPCB with 20-pin Board to Board connector(AXK720145 - VGA Camera).

  • Page 48: Camera Regulator

    3.2.4 Camera Regulator GPIO_31 enables the 1.8V Camera Regulator for the 1.3M Camera Digital Core. GPIO_20 enables the MEGA_2.8V Camera and GPIO_02 enables the VGA_2.8V Camera Regulator. VBATI VCAM_1.8V VBATI VCAM_2.8V R501 U502 U503 R526 VDD VOUT VOUT R508 R527 CAM18_EN CAM28_EN C501...

  • Page 49: Display & Lcd Fpc Interface

    3. Technical Brief 3.2.5 Display & LCD FPC Interface LCD module include device in table 3-2-3 Device Type Main LCD 220 X RGB X 220 262K Color TFT LCD Sub LCD 128 X RGB X 160 262K Color TFT LCD Main/Sub LCD Backlight 5 White LEDs (simultaneously) Table 3-2-3.
  • Page 50 3. Technical Brief Pin Name Pin Type Description Unused Pin The Logic Power Supply for LDI and LCM The Analogue Power Supply for LDI and LCM S_RESET Sub Reset Pin. Initialize the LSI at the low level M_RESET Main Reset Pin. Initialize the LSI at the low level SUB_CS Sub Chip Select, Active low Bi-Direction Data Bus...

  • Page 51: Main&Sub Lcd Backlight Illumination

    3. Technical Brief 3.2.6 Main&Sub LCD Backlight Illumination There are 5 white LEDs for the Main LCD and the Sub LCD Backlight circuit which are driven by the Charge Pump(LTC3206EUF). I2C is used for the backlight brightness control. GPIO_46 enables the Charge Pump IC.

  • Page 52: Keypad Illumination

    3. Technical Brief 3.2.8 Keypad Illumination There are 19 blue LEDs in key board backlight circuit, which are driven by GPIO32 (KEY_LED_ONOFF) line form Marita. R741 2.7K KEY_LED_ONOFF R742 Q701 EMX18 R727 KEY_LED- Keypad Backlight Control Figure 3-2-11. Keypad Backlight Blue LED Interface VBATI 100K PG05DBTFC...

  • Page 53: Lcd Module

    3. Technical Brief 3.3 LCD Module Ear Piece 40pin BtoB 50pin BtoB Camera&LCD FPCB Main Board LCD Module Connector Connector 20pin BtoB Connector VGA Camera Figure 3-3-1. LCD Module Block Diagram Figure 3-3-2. LCD Module (Main & Sub LCD) - 54 -...

  • Page 54: Analog Baseband (Abb) Processor

    3. Technical Brief 3.4 Analog Baseband (ABB) Processor 3.4.1 Overview of Audio path MARITA Digital Baseband ASIC Voice Call RX Videp Telephony RX VINCENNE Audio and Power Management ASIC Receiver Tone Generator Audio Mixer MIDI or WAVE TJATTE2 C-MIC HEADSET AMP Filter Voice Call TX 3D IC...

  • Page 55: Audio Signal Processing & Interface

    3. Technical Brief 3.4.2 Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MARITA). This transmitted signal is reformed to fit in GSM &...
  • Page 56 VSSTH16 VDD1 C517 C519 C578 VDD2 2700p C525 R531 SPK_RIGHT_M C560 SPK_RIGHT_P Engineer: LG ELECTRONICS INC. R530 Jeongseok Lee AUDIO_AMP_EN Mobile Handsets R&D Center Drawn by: HW Group, Development Lab 6. Jeongseok Lee R529 R&D CHK: Size: TITLE: 100K U8550-spfy0106301-1.1...

  • Page 57: Audio Mode

    3. Technical Brief 3.4.3 Audio Mode Audio Mode includes three states(Voice call, Midi, MP3) Each states is sorted by the total 7 Modes according to external Devices. (Receiver,Loud Speaker,Headset) Video Telephony Mode Operate on state of the WCDMA Call. VINCENNE In / Out Port Mode Receiver Mode MIC1P/MIC1N...

  • Page 58: Voice Call

    3. Technical Brief 3.4.4 Voice Call A. Voice call Downlink Mode(Receiver, Speaker, Headset) This section provides a detailed description of the Voice Call RX functions. Voice Call RX Audio Mixer FR Speech Decoder HR Speech Decoder Compressor Speech Coded Acoustic Compensation Data from Host AMR Speech...
  • Page 59 3. Technical Brief The voice decoder accepts a serial input stream of linear PCM coded speech. The receive band-pass filter is the next step in the CODEC receive path. Following the filter is the DAC, followed by a PGA enabling to adjust or trim the circuit in the product for different sensitivity of the earphone and spread in the RX path.
  • Page 60 3. Technical Brief B. Voice call Uplink Mode(Receiver, Speaker, Headset) This section provides a detailed description of the Voice Call TX functions. Audio Codec (TX-path) Audio Mixer MIC1 to Analog Sidetone AUXO1 Loop Loop Loop Bluetooth Module MIC1N Microphone Input 1 MIC1P Encoder ADC1...

  • Page 61: Midi (Ring Tone Play)

    3. Technical Brief 3.4.5 MIDI (Ring Tone Play) This section provides a detailed description of the MIDI and WAV-file functions. Digital Baseband ASIC VINCENNE MIDI or WAVE Audio and Power Audio Mixer Management ASIC TJATTE2 Filter HEADSET AMP 3D IC HEADSET CODEC Analog S/W...

  • Page 62: Mp3 (Audio Player)

    3. Technical Brief 3.4.6 MP3 (Audio Player) This section provides a detailed description of the MP3 file functions. MARITA Digital Baseband ASIC VINCENNE TJATTE2 Audio and Power Audio Mixer Management ASIC HEADSET AMP Filter 3D IC HEADSET CODEC 3D effect Analog S/W Speaker SPEAKER AMP...

  • Page 63: Video Telephony

    3. Technical Brief 3.4.7 Video Telephony This section provides a description of the Video Telephony functions. MARITA Digital Baseband ASIC Videp Telephony RX VINCENNE Audio Mixer Audio and Power Management ASIC TJATTE2 C-MIC HEADSET AMP Filter 3D IC CODEC HEADSET Videp Telephony TX By pass Analog S/W...

  • Page 64: Audio Part Main Components

    3. Technical Brief 3.4.8 Audio Part Main Components There are 8 components in U8550 schematic Diagram. Part Number marked on U8550 Schematic Diagram. ITEM Part Name Part Number Speaker EMS1514TLW1P C-MIC OBG-415S44 X503 3D IC NJM2705 U507 Audio AMP TPA2005D1...
  • Page 65 3. Technical Brief 47K Ω ATMS ATMS_AD 2.7K Ω 1450 Ω 1450 Ω ATMS-cap ATMS-int 13.4K Ω 20 pF 1K Ω 50 Ω 50 Ω MICP MICP-int 50 pF 50 Ω 50 Ω MICN MICN-int 50 pF 1K Ω 10 Ω AFMS_R-int AFMS_R 200 pF...

  • Page 66: Gpadc(General Purpose Adc) And Autoadc2

    3. Technical Brief 3.4.9 GPADC(General Purpose ADC) and AUTOADC2 The GPADC consists of a 14 input MUX and an 8-bit ADC. The analog input signal is selected with the MUX and converted in the ADC. The GPADC has a built in controller, AUTOADC2, which is able to operate in the background without software intervention.

  • Page 67: Charger Control

    3. Technical Brief 3.4.10 Charger control A programmable charger in AB2000 is used for battery charging. It is possible to set limits for the output voltage at CHSENSE- and the output current from DCIO via the sense resistor to CHSENSE-. The voltage at CHSENSE- and the current feed to CHSENSE- cannot be measured directly by the GPADC.

  • Page 68: Fuel Gauge

    AB2000(VINCENNE) supports the measurement of the current consumption/charging current in the U8550 with a fuel gauge block. By constantly integrating the current flowing into and out of the battery, the fuel gauge block is used to determine the remaining battery capacity.

  • Page 69: Battery Temperature Measurement

    3. Technical Brief 3.4.12 Battery Temperature Measurement The BDATA node, the constant current source, feed the battery data output while monitoring the voltage at the battery data node with GPADC. This battery data is converted to the battery temperature. Figure 3-4-16 shows the schematic of battery temperature measurement part. R2194 BDATA R548...

  • Page 70: Charging Part

    3. Technical Brief 3.4.13 Charging Part The charging block in AB2000 processes the charging operation by using VBAT voltage. It is enabled or disabled by the assertion/negation of the external signal DCIO. Part of the charging block are activated and deactivated depending on the level of VBAT. Figure 3-4-17 shows the schematic of charging part.
  • Page 71 3. Technical Brief A. Trickle charging When the VBAT is below a certain value, 3.2V, a current generator take care of internal trickle charge signal is active. The charging current is set to 50mA. Parameter Unit Trickle current Table 3-4-8. Trickle charging spec B.
  • Page 72 3. Technical Brief • Charging Method : CCCV (Constant Current Constant Voltage) • Maximum Charging Voltage : 4.2V • Maximum Charging Current : 700mA • Nominal Battery Capacity : 1400 mAh • Charger Voltage : 4.6V • Charging time : Max 3.5h •...

  • Page 73: Voltage Regulation

    VBAT to 1.5V for VCORE and VRTC, and to 1.8V for VMEM voltage. The output of these LDOs and BUCK converter are as following (Table 1). (Fig.1) shows the power supply of each module in U8550. 3.5.2 External Regulation •...
  • Page 74 3. Technical Brief Figure 3-5-1. Power supply scheme Name Type Output voltage Description VDD_A Power Supply 2.75V Supply output VDD_B Power Supply 2.75V Supply output VDD_D Power Supply 2.75V Supply output VDD_E Power Supply 1.8V Supply output VDDLP Power Supply 1.5V Low Power supply output VDDBUCK...

  • Page 75: General Description Of Rf Part

    3. Technical Brief 3.6 General Description of RF Part The RF part includes a tri-band GSM/DCS/PCS part (900, 1800 and 1900MHz) and W-CDMA part for IMT-2000 (UL 1900MHz, dl 2100MHz). It also contains Antenna Switch, WCDMA duplexer, WCDMA Power Amplifier and GSM Power Amplifier. The whole structure of Radio part is shown in Figure 3-6-1.
  • Page 76 3. Technical Brief WCDMA RF ASIC Ctrl Wopy WANDA WCDMA Wivi Antenna Antenna Switch Ctrl Swit ch Herta Ingela GSM RF Mari ta ASIC Ctrl GSM/DCS Band select GSM/DCS PA Ctrl Vincenne Ctrl DAC Ctrl (Indirect WCDMA PA Ctrl GSM PA Pwr Ctrl) Vincenne VCXO Ctrl DAC Ctrl (Indirect WCDMA...

  • Page 77: Gsm Mode

    3. Technical Brief 3.7 GSM Mode 3.7.1 Receiver The received RF signal on the antenna connector arrives via antenna switch at external band pass filters for band selectivity. One filter is required per supported GSM band. The corresponding LNA amplifies the signal for optimum noise suppression. The LNA output signal is mixed with the on-channel LO generated by the proper VCO and transformed into a Q and an I signal.
  • Page 78 3. Technical Brief B. Receiver Block The circuit contains one frequency down-conversion section for each receive band and a common base band amplifier and filter section. The GSM900 RF part consists of a low noise amplifier followed by high dynamic range mixers. The DCS 1800 and PCS 1900 RF part also have low noise amplifier connected to the other mixers.
  • Page 79 3. Technical Brief C. LO Block The LO signals from the receive VCO section drive the dividers for GSM 900, DCS 1800 and PCS 1900 respectively to provide quadrature LO signals to the receive mixers. The LO signal is also supplied to the prescaler and transmit output buffer.
  • Page 80 3. Technical Brief D. VCO Block The VCOs are fully integrated balanced LC oscillators with on-chip resonators. The receive VCOs run on double frequency. Different frequency ranges can be selected in the VCOs for GSM, DCS and PCS band operation. The VCOs are supplied from a separated external voltage regulator to avoid frequency pushing and up conversion of low frequency noise.
  • Page 81 3. Technical Brief E. PLL Block The PLL consists of a programmable prescaler with multiple division ratios and a phase and frequency detector with a charge pump with programmable output current. Channel frequency selection and transmitter modulation is controlled via the prescaler modulus inputs MODA ~ MODD and the prescaler offset value N offset.

  • Page 82: Transmitter

    3. Technical Brief 3.7.2 Transmitter A 4-bit sigma-delta bit stream comes from the Marita ASIC including both channel information and the GMSK phase information. Via the 3-wire control bus also driven from Marita, the selection of transmitter band is made. The 4bits from the bit stream provides the fine-tuning of the division ratio before going to the divider of the used VCO (low band, 900MHz or high band, 1800/1900MHz).
  • Page 83 3. Technical Brief A. Power Amplifier The Power Amplifier (N401) is intended for use in EGSM and DCS/PCS mobile equipment. It is a module with two parallel amplifier chains, with one chain for the EGSM transmitter section and one for the DCS/PCS transmitter section. Each chain amplifies the RF signal from the respective transmitter to the antenna.

  • Page 84: Wcdma Mode

    3. Technical Brief 3.8 WCDMA Mode 3.8.1 Receiver The received RF signal on the antenna connector arrives via the antenna switch to the duplexer. The duplexer directs the signal to the LNA, which resides in Wopy (W-CDMA Receive ASIC) as every other active part of the radio receiver.
  • Page 85 3. Technical Brief B. RFLO Section The VCO is a fully integrated balanced LC oscillator with on-chip resonator. An on-chip varactor is used to control the frequency over the desired tuning range. A separate external voltage regulator supplies the VCO with power to avoid frequency pushing and up conversion of low frequency noise.
  • Page 86 3. Technical Brief C. Reference Section The reference block consists of a balanced oscillator and a buffer amplifier. The crystal unit and the feedback capacitors are external. The current consumption when only the reference oscillator and the output buffer are activated must be kept to an absolute minimum. To PLL XOOON XOIA...

  • Page 87: Transmitter

    3. Technical Brief 3.8.2 Transmitter Analogue differential signals (currents), representing I and Q, are sent to the radio ASCI Wivi (W- CDMA Transmitter ASIC) from the D/A converter in Wanda (W-CDMA digital base-band coprocessor ASIC). The signals are filtered in a reconstruction filter and then modulated up to 380MHz (using the IFLO signal).
  • Page 88 3. Technical Brief C. Variable Gain Amplifier(VGA) Comprising two cascaded variable gain amplifiers, the VGA-together with the RF mixer-controls the power of the transmitter. The first of these two amplifiers, the so-called QVGA, enables fine-tuning of the transmitter by varying the gain in 0.25dB steps, that is 0/0.25/0.5/0.75dB.
  • Page 89 (RF). The mixer can be switched between three different gain levels: high gain (HG), medium gain (MG), and low gain (LG). The LO buffer provides the buffering for either an internal LO signal generated within the internal RFPLL, or an external LO signal applied to the RFLO/RFLOBAR pins.
  • Page 90 3. Technical Brief F. Power Amplifier The N302(RF9266) is a high-power, high-efficiency linear amplifier module targeting W-CDMA transmitter ASIC. The module is fully matched to 50ߟ for easy system integration and utilizes advanced GaAs HBT process technology. The PA features an integrated RF power output detection network and is compatible with DC-DC converter operation in DC power management applications.

  • Page 91: Frequency Generation

    3. Technical Brief 3.8.3 Frequency Generation The Wopy (W-CDMA Receive ASIC) contains the active elements for a 13MHz VCXO, which is designed to be the reference frequency of the UE. There are two synthesizers in the W-CDMA part of the radio, an intermediate frequency (IF) synthesizer and a radio frequency (RF) synthesizer.
  • Page 92 3. Technical Brief A. IF PLL The IF LO frequency synthesis comprises the four following par is: - Input buffer: A 13MHz input buffer with DC-biasing provided at source. - VCO: Operating on 1.52GHz which is 4times the TX-IF frequency (380MHz) and 8 times the RX-IF (190MHz), this is a fully integrated balanced LC oscillator with on-chip resonator.

  • Page 93: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Power ON Trouble START Charge or change The voltage of main battery main battery is higher than 3.2V ? Follow the Press END key. Keypad backlight Keypad LED ON? Trouble shooting guide Follow the END key operates well? keypad Trouble ONSWAn(C597) level is low...
  • Page 94 4. TROUBLE SHOOTING N502 N405 D601 R2250 R2251 <Top view> N201 R560 R551 R563 N503 R600 C597 N702 <Bottom view> - 95 -...

  • Page 95: Usb Trouble

    4. TROUBLE SHOOTING 4.2 USB Trouble START (Measure during the state of USB module running) Check host USB port Input power(N501, Pin#1) is 5V? or USB cable Resolder or change N501 Output power(N501, Pin#5) is 3.3V? Resolder R513or R514 USBSENSE level is 2.8V? Resolder C623 VUSB(C623) is 3.3V? Change main board...

  • Page 96: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.3 SIM Detect Trouble • • SIM control path - MARITA generates SIM interface signals(2.75V level) to VINCENNE. - Vincenne converts SIM interface signals to 3V/5V. START Reconnect SIM card Finish SIM work well? Resolder X502 on main PCB and check the contact between X502 and SIM card <Bottom view>...

  • Page 97: Transflash Trouble

    4. TROUBLE SHOOTING 4.4 TransFlash Trouble START Re-insert TransFlash TransFlash work well? Finish Check operation of TransFlash using other notebook or PDA TransFlash work well? Change the TransFlash <Top view> Re-insert TransFlash Check output of U510 C636 VTF(C636) is 2.85V? Resolder C636 S601 R653...

  • Page 98: Keypad Trouble

    4. TROUBLE SHOOTING 4-5 Keypad Trouble Keypad singals to MARITA and VINCENNE through board-to-board connector. START Press the Keypad Keypad operates well? Resolder B to B connector Check B to B connector short? CN703(Main Bíd), CN1(Keypad) CN703(Main Bíd) or CN1(Keypad) Keypad operates well? Change Keypad Keypad operates well?
  • Page 99 4. TROUBLE SHOOTING Keypad signals to MARITA and VINCENNE through board-to-board connector. CN703 Pin #16 ~ #21 KEYOUT5 KEYIN0 KEYOUT4 KEYIN1 KEYOUT3 KEYIN2 KEYOUT2 KEYIN3 KEYOUT1 KEYIN4 KEYOUT0 OMSWAn Pin #4 ~ #9 KEYOUT5 Pin #16 ~ #21 KEYOUT4 KEYIN0 KEYOUT3 KEYIN1 KEYOUT2...

  • Page 100: M Camera Trouble

    4. TROUBLE SHOOTING 4-6 1.3M Camera Trouble Camera control signals are generated by Marita START Press END Key to turn on the power Follow the Power On Trouble Is the circuit powered? Shooting Reconnect the 26pin B to B connector CN702 and 1.3M Camera Connector 1.3M Camera Operation OK? Pin 5 of U502 or C504 = 1.8V?
  • Page 101 4. TROUBLE SHOOTING CN702 C523 U503 U502 C504 - 102 -...

  • Page 102: Vga Camera Trouble

    4. TROUBLE SHOOTING 4-7 VGA Camera Trouble Camera control signals are generated by Marita START Press END Key to turn on the power Follow the Power On Trouble Is the circuit powered? Shooting Reconnect the 50pin B to B connector CN701 and VGA Camera Connector VGA Camera Operation OK? Pin 5 of U501 or R721 = 2.8V?
  • Page 103 4. TROUBLE SHOOTING CN701 U501 R721 - 104 -...

  • Page 104: Main Lcd Trouble

    4. TROUBLE SHOOTING 4-8 Main LCD Trouble LCD control signals are generated by Marita START Press END Key to turn on the power Follow the Power On Trouble Follow the Power On Trouble Is the circuit powered? Shooting Shooting Disconnect and Reconnect the 50pin B to B connector (FPCB and Main) LCD Display OK? Disconnect and Reconnect the 40pin...
  • Page 105 4. TROUBLE SHOOTING CN701 Main Board 50 pin B to B Connector FPCB Board 50 pin B to B Connector FPCB Board 40 pin BtoB Connector LCD Module 40 pin BtoB Connector - 106 -...

  • Page 106: Sub Lcd Trouble

    4. TROUBLE SHOOTING 4-9 Sub LCD Trouble START Press END Key to turn on the power Follow the Power On Trouble Follow the Power On Trouble Is the circuit powered? Shooting Shooting Disconnect and Reconnect the 50pin B to B connector (FPCB and Main) Sub LCD Display OK? Disconnect and Reconnect the 40pin B to B connector (LCD and FPCB)
  • Page 107 4. TROUBLE SHOOTING CN701 Main Board 50 pin B to B Connector FPCB Board 50 pin B to B Connector FPCB Board 40 pin BtoB Connector LCD Module 40 pin BtoB Connector - 108 -...

  • Page 108: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4-10 Keypad Backlight Trouble START Press END Key to turn on the power Keypad Backlight Works? Backlight Control Signal is 2.8V at R741? Resolder or Change Q701 Keypad Backlight Works? Change Keypad Keypad Backlight Works? Finish Change Main Board - 109 -...
  • Page 109 4. TROUBLE SHOOTING R741 2.7K KEY_LED_ONOFF R742 Q701 EMX18 R727 KEY_LED- Keypad Backlight Control VBATI 100K PG05DBTFC 100K 0.1u PG05DBTFC 100K PG05DBTFC KEY_LED- Q701 R741 - 110 -...

  • Page 110: Camera Flash Trouble

    4. TROUBLE SHOOTING 4-11 Camera Flash Trouble START Press END Key to turn on the power Follow the Power On Trouble Is the circuit powered? Shooting Disconnect and Reconnect the 26pin BtoB connector (FPCB and Main) Change Flash LED Camera Flash Works? Check Flash LEDs (4.0V Direct Power Supply) Pin16,Pin17,Pin18 of U701...
  • Page 111 4. TROUBLE SHOOTING CN702 Over 3.5V? Pin17 Pin18 Pin16 U701 - 112 -...

  • Page 112: Audio Trouble

    4. TROUBLE SHOOTING 4.12 Audio Trouble 4.12.1 Receiver • Signals to the receiver - Receiver signals are generated at Vincenne BEARP, BEARM • - Receiver path : Vincenne (BEARP, BEARM) → • CN701 on main board → • LCD Module → •...
  • Page 113 4. TROUBLE SHOOTING START Connect the phone to network Equipment and setup call Setup 1KHz tone out Does the sine wave appear Change the main board at L501,L502 ? The sine wave not appear Does the sine wave appear Check R510,R511 at Number 47, 48 pin in the main Bíd CN701? Does the sine wave appear...
  • Page 114 4. TROUBLE SHOOTING Pin 47,48 L501,L502 B SIDE - 115 -...
  • Page 115 4. TROUBLE SHOOTING Measured 1khz Sine Wave Signal Measured 1khz Sine Wave Signal - 116 -...

  • Page 116: Speaker

    4. TROUBLE SHOOTING 4.12.2 Speaker (Voice Loud Speaker,Midi, MP3,Key Tone) Signals to the speaker • AUXO1/Right, AUXO2/Left - AUXO1/Right, AUXO2/Left • Speaker path : - Vincenne (AUXO1/Right, AUXO2/Left) → - U507(Surround Audio Processor) on the main board → - C584,C585 on the main board → - N504(ADG) on the main board →...
  • Page 117 4. TROUBLE SHOOTING START Connect the phone to network Equipment and setup call Setup 1KHz tone out Does the sine wave appear Change the main board at C572,C573 ? The sine wave not appear Does the sine wave appear Change U507 at C584,C585 ? Does the sine wave appear Change the main board...
  • Page 118 4. TROUBLE SHOOTING CN703 #22,23 R533,R539 R582,R584 C584,C585 C572,C573 CN3, CN4 - 119 -...
  • Page 119 4. TROUBLE SHOOTING Measured 1khz Sine Wave Signal - 120 -...

  • Page 120: Microphone

    4. TROUBLE SHOOTING 4.12.3 Microphone (Voice call, Voice Recorder, Video Recorder) • • Microphone Signal Flow - MIC is enable by MIC Bias - MICBAS, MICIP, MICIN signals to ABB (Vincenne) • • Check Points - Microphone bias - Audio signal level of the microphone - Soldering of components •...
  • Page 121 4. TROUBLE SHOOTING START Check the MIC bias level at the pad of MIC+(X503) Check the signal level Is the level of MIC+ AND MIC- at C568 at the putting 2.4Volt ? Audio signal in MIC Resolder C566,C567, C568 and try again. A few hundred of mV If fail again, of the signal measured ?
  • Page 122 4. TROUBLE SHOOTING C566 C567 C568 - 123 -...
  • Page 123 4. TROUBLE SHOOTING Measured Some Noise Signal - 124 -...

  • Page 124: Headset - Receiver

    4. TROUBLE SHOOTING 4.12.4 Headset - Receiver(Voice call, Video Telephony,MP3) START Connect the phone to network Equipment and setup call Setup 1KHz tone out Insert Headset. Does the Headset icon display Does the level of R2252 on the main LCD? under 0.5Volt ? Does the sine wave appear Change the main B,d...

  • Page 125: Headset - Mic

    4. TROUBLE SHOOTING 4.12.5 Headset - MIC(Voice call, Video Telephony) START Insert Headset. Does the level of R2252 Does the Headset icon display under 0.5Volt ? on the main LCD? Check the signal level at R569 at the putting Change the main B,d Audio signal in MIC Resolder C554, A few hundred of mV...

  • Page 126: Headset

    4. TROUBLE SHOOTING 4.12.6 Headset R2252 C572,C573 C584,C585 C592,C593 CN502 C554 R569 C575 - 127 -...

  • Page 127: Charger Trouble

    4. TROUBLE SHOOTING 4.13 Charger Trouble GPA12 C532 GPA13 DCIN_3 DCIO CHREG CHSENSE+ CHSENSE- Q501 R2236 FGSENSE+ DCIN_2 R899 R2205 FGSENSE- SI7411DN-T1-E3 VSS_A C599 C548 VSS_B VSS_C VBATI VBAT VSS_D VSSBUCK TEST Figure 4-13-1. Main Battery Charging Path • • Charging Procedure - Connecting TA and Charger Detection - Control the charging current by AB2000(Vincenne) - Charging current flows into the battery...
  • Page 128 4. TROUBLE SHOOTING start start Check the pin and battery Check the pin and battery connect terminals of I/O connect terminals of I/O connector connector Connection OK? Connection OK? Change I/O connector Change I/O connector Is the TA voltage 4.6V? Change TA Change TA Is it charging properly...

  • Page 129: Rf Component

    4. TROUBLE SHOOTING 4.14 RF Component N303 B301 FL102 N302 N402 N301 N403 N404 FL402 FL403 Z401 N405 Figure 4-14-1. RF component (Top) Reference Description Reference Description N301 VOLTAGE_REGULATOR N403 DCS_TX_BALUN N402 HERTA (GSM ADC) N404 GSM_TX_BALUN N302 WCDMA PAM FL402 DCS_RX_SAW N303...
  • Page 130 4. TROUBLE SHOOTING FL401 FL301 N401 W101 FL101 FL201 N304 N201 N101 B201 V201 Z201 Figure 4-14-2. RF component (Bottom) Reference Description Reference Description W101 TEST CONNECTOR Z201 WCDMA RX IF SAW N401 GSM PAM V201 DIODE/VARIABLE CAP FL401 EMI FILTER B201 CRYSTAL FL301...

  • Page 131: Procedure To Check

    4. TROUBLE SHOOTING 4.15 Procedure to check start Oscilloscope setting 1. Check Power Source Block 2. Check VCXO Block 3. Check Ant. SW Module Agillent 8960 : Test mode(WCDMA) Ch. 9750 (Uplink) Ch. 10700 (Downlink) 4. Check WCDMA Block Agillent 8960 : Test mode(GSM) Ch.

  • Page 132: Checking Common Power Source Block

    4. TROUBLE SHOOTING 4.16 Checking Common Power Source Block ➂ Step 2 GSM PAM Block ➀ Step 1 Regulator Block ➃ Vincenne Step 3 WCDMA PAM Block ➁ ➄ Power Source Block (Top) (Bottom) Figure 4-16-1. Common Source Block - 133 -...
  • Page 133 4. TROUBLE SHOOTING 4.16 Checking Common Power Source Block Diagram VBAT Vincenne 0.1ohm VBATI PASENSE+ VDDRTC VDDBUF VBAT_A VDD_D VBAT_C (2.75V/200mA) VDDBUCK VDDPA SWBUCK VSSBUCK VDD_E PBUCK (1.8V/100mA) NBUCK DCIO VDD_B VBUCK VDD_A VDD_IO VCORE(1.5V) VDD_D 2.75V Ingela VCCA VCCB 2.75V Wopy Herta...
  • Page 134 4. TROUBLE SHOOTING 4.16.1 Step 1 Check VBATI (R105) LP3981ILD-2.8 ➀ Figure 4-16-2. Step 1 : Regulator Block Check point R875 (C740) R847 ➄ Figure 4-16-3. Power Source Block Step 1 3.7V Check Point (C740) in ➄ Power Source Block To Check Power source to Check if See The Step 2...
  • Page 135 4. TROUBLE SHOOTING 4.16.2 Step 2 ➁ GSM PAM VBATI (R407) FL401 (Top) ➁ Figure 4-16-4. Step 2 :GSM PAM Block Step 2 Check VBATI (R407) 3.7V ➁ in GSM PAM Block to Check if main power source input or not See The Step 3 Check FL401 3.7V...
  • Page 136 4. TROUBLE SHOOTING 4.16.3 Step 3 WCDMA PAM VBATI (R307) ➂ Figure 4-16-5. Step 3 :WCDMA PAM Block Check point R875 (C740) R847 ➄ Figure 4-16-6. PAM Power Source Step 3 3.7V Check VBATI (R307) ➂ in WCDMA PAM Block See The Next Page Check Point (C740) 3.7V...
  • Page 137 4. TROUBLE SHOOTING VDDB (R2251) VDDA ( R2250) Bottom Figure 4-16-7. Power for Radio ASIC Ingela(N405) Vincenne R2250 (N503) R2251 Wopy (N201) C116 C117 C115 2012 2012 2012 2.75V Check the Vincenne Check Point 2.75V OK? Check the Vincenne (VDDB) Common Input Power is OK See The Next Part - 138 -...
  • Page 138 4. TROUBLE SHOOTING 4.16.5 Checking Regulator Part V_ wivi_B ➁ (R104) ➃ EXTLDO V_ wivi_A (R103) ➂ (R106) LP3981ILD-2.8 Regulator Figure 4-16-8. Regulator Block ➂ ➃ R106 >> V_wivi_A ➁ TXTLDO >> R103 R104 >> V_wivi_B N101 LP3981ILD-2.8 VOUT R105 VBATI >>...

  • Page 139: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.17 Checking VCXO Block The reference frequency (13MHz) from B201 (Crystal) is used WCDMA TX part and BB part. Therefore you have to check below 3 point. Check 3 Check 2 Check 1 Figure 4-17-1. Bottom Place - 140 -...
  • Page 140 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. B201.3 Figure 4-17-2. Test Point (Crystal Part) C231 C230 R216 R212 VCXOCONT 330p C234 C232 C224 R214 V201 2.7p 4.7p 0.01u B201 BBY58-02W TSX-8A...
  • Page 141 4. TROUBLE SHOOTING Check 2. 13MHz at TX part N304.B1 N304.C1 Figure 4-17-5. Test point (13MHz at TX part) TP302 TP301 C331 C332 0.01u XOOA XOOB TP303 TP304 TP305 TP306 TXQB QINBAR TXQA TXIB INBAR TXIA N304.B1 N304.C1 Figure 4-17-6. Schematic of the Tx Part Figure 4-17-7.
  • Page 142 4. TROUBLE SHOOTING Check 3. 13MHz at BB part N201.C1 Figure 4-17-8. Test point (13MHz at BB part) N201.C1 R210 MCLK L208 C221 C219 0.01u C223 0.01u R215 VDD_B C225 C231 C230 R216 R212 VCXOCONT 330p C234 2.7p VCCREF XOIA Figure 4-17-9.
  • Page 143 4. TROUBLE SHOOTING VCXO part has a problem. Check B201.3 Checking 1 Changing B201 13MH z at VCXO Refer to graph 4-17-4 Check N304.B1 & C1 N 304 has any problem. Checking 2 Refer to graph 4-17-7 Changing RF board 13MH z at TX part Check N304.C1 N 304 has any problem.

  • Page 144: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.18 Checking Ant. SW Module Block ANTSW2 ANTSW1 ANTSW0 LMSP43MA-288 ANTSW3 Figure 4-18-1. Antenna Switch Block(Bottom) FL101 LMSP43MA-288 GSM900_RX GSM1800_RX GSM1900_RX WCDMA GSM18001900_TX L105 GSM900_TX ANTSW0 L104 ANTSW1 L103 ANTSW2 R102 ANTSW3 C110 C107 C106 C109 C105 C108 C102 C104...

  • Page 145: Checking Antenna Switch Block Input Logic

    4. TROUBLE SHOOTING 4.19 Checking Antenna Switch Block input logic 4.19.1 Mode Logic by TP Command WCDMA & EGSM Rx EGSM Tx ANTSW1 ANTSW2 High ANTSW3 DCS Rx DCS Tx ANTSW1 High ANTSW2 High High ANTSW3 PCS Rx ANTSW1 High ANTSW2 ANTSW3 - 146 -...
  • Page 146 4. TROUBLE SHOOTING Band ANTSW0 ANTSW1 ANTSW2 ANTSW3 EGSM Tx EGSM Rx DCS Tx DCS Rx PCS RX WCDMA Figure 4-19-1. Antenna Switch Module Logic - 147 -...

  • Page 147: Checking Switch Block Power Source

    4. TROUBLE SHOOTING 4.19.2 Checking Switch Block power source Before Checking this part, must check common power source(through Vincenne) part TP Command MODE=0 SWRX=64,1024,2 Check Soldering Open? It is necessary to check short condition. Using Tester. Check 4 resistor ANTSW0(L105),ANTSW1(L104) Check soldering ANTSW2(L103),ANTSW3(R102) (L105)
  • Page 148 4. TROUBLE SHOOTING A. EGSM Rx mode EGSM Rx MODE=0 SWRX=64,1024,2 ANTSW1 ANTSW2 ANTSW3 High Figure 4-19-2. EGSM Rx Mode B. EGSM Tx mode EGSM Tx MODE=0 SWTX=1,64,7,1024,1 ANTSW1 ANTSW2 ANTSW3 High Figure 4-19-3. EGSM Tx Mode - 149 -...
  • Page 149 4. TROUBLE SHOOTING C. DCS Rx mode DCS Rx MODE=2 SWRX=699,1024,2 ANTSW1 ANTSW2 High ANTSW3 Figure 4-19-4. DCS Rx Mode D. PCS Rx mode PCS Rx MODE=1 SWRX=661,1024,2 ANTSW1 High ANTSW2 ANTSW3 Figure 4-19-5. PCS Rx Mode - 150 -...
  • Page 150 4. TROUBLE SHOOTING E. DCS / PCS Tx mode DCS / PCS Tx MODE=2 SWTX=1,699,0,1024,1 ANTSW1 High High ANTSW2 ANTSW3 Figure 4-19-6. DCS / PCS Tx Mode - 151 -...
  • Page 151 4. TROUBLE SHOOTING F. WCDMA mode WCDMA Mode MODE=4 WTXC=9750,1,1,43,0,0,255,68 ANTSW1 ANTSW2 ANTSW3 Figure 4-19-7. WCDMA Mode Each Mode Check MARITA(D601) Logic OK? Input Signal and Power to Antenna Switch Block is OK. See the Next Page - 152 -...

  • Page 152: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.20 Checking WCDMA Block start 1. Check VCXO Block ➁ 2. Check Ant. SW Module ➆ 3. Check ➀ Control Signal ➂ Bottom View 4. Check RF TX Level 5. Check ➃ PAM Block ➄ 6. Check Top View RX IQ 7.

  • Page 153: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.20.1 Checking VCXO Block Refer to 4.17 4.20.2 Checking Ant. SW module Refer to 4.18 4.20.3 Checking Control Signal First of all, you have to check control signal. (data, clk, strobe) TP203(CLK) TP202(DATA) TP201(STROBE) Figure 4-20-1. Test point (Control Signal) IFOUTB VCCMIX MIXINA...
  • Page 154 4. TROUBLE SHOOTING TP201(STROBE) TP202(DATA) TP203(CLK) TP201(STROBE) TP202(DATA) TP203(CLK) Figure 4-20-3. Control Signal Check TP2011,TP202 TP203. Check shape Similar ? and pk-pk level Download the SW Refer to Graph 4-30 After downloading If signal is not OK Change the D701 Control Signal is O.K.

  • Page 155: Checking Rf Tx Level

    4. TROUBLE SHOOTING 4.20.4 Checking RF TX Level Check 1 W101 Check 2 FL101.C103 Switch Output Check 6 N302.C307 Check 3 PAM Input FL102.C111 Check 5 Check 4 N303.Isolator Input N303. Isolator Output Figure 4-20-4. Test point (RF TX Level) Fig.
  • Page 156 4. TROUBLE SHOOTING Fig. 4-20-7 Output Level at FL102.C111 Fig. 4-20-8 Output Level at Isolator Output (N303.Out ) Fig. 4-20-9 Output Level at Isolator Input Fig. 4-20-10 Output Level at PAM Input ( N303. In) ( N302,C307) Fig. 4-20-11 Output Level at Wivi Output ( N304.C320) - 157 -...
  • Page 157 4. TROUBLE SHOOTING To verify that the phone fulfils requirments on maximum output power. Set the FDD Test of the Agillent 8960 Set the Maximum Power Check output power at Check 1 the W101 with antenna RF TX Level is OK About 23dBm? Cable.

  • Page 158: Checking Pam Block

    4. TROUBLE SHOOTING 4.20.5 Checking PAM Block (Top) VCCWPA WDCDCREF (C302) (C310) from Rosaili Rosaili WCDMA PAM Duplexer Output Comp(R301) Wivi input WPAREF (C111) (C307) (R306) Figure 4-20-12. Test point - 159 -...
  • Page 159 4. TROUBLE SHOOTING WCDMA_TX N303 ESI-3EAR1.950G01-T VCCWPA N302 RF9266 GND5 VDETECT VBATI GND6 VCC_DET GND7 GND2 R307 VCC21 VCC_BIAS2 C308 VCC22 VCC_BIAS1 0.01u GND8 GND1 VCC11 VCTRL2 R306 WPAREF VCC12 VCTRL1 C311 C310 0.1u C309 Figure 4-20-13. Schematic(PAM) VBATI N301 WDCDCREF MAX1820ZEBC _SKIP...
  • Page 160 4. TROUBLE SHOOTING TP Command -mode =4 -wtxc = 9750,1,1,43,0,0,255,68 Check Duplex output Level Download the SW (C111) 23dBm ? < - & Calibrate To Check PAM 10dBm? output WCDMA PAM is OK See the Next page Check C307 Level Check the WCDMA RF Tx Chip(Wivi) >2dBm To Check PAM Input...

  • Page 161: Checking Rx I,Q

    4.20.6 Checking RX I,Q To verify the RX path you have to check the pk-pk level and the shape of the RX I,Q. N201.A7 (RXQA) C227 N201.A8 (RXQB) C229 N201.A9 (RXIA) C228 N201.A10 (RXIB) C226 Figure 4-20-15. WCDMA RF RX IC (Bottom) About 2 MHz Feed a CW signal at 2142MHz with a power level of ñ60dBm.
  • Page 162 N201.A7 (RXQA) C227 N201.A8 (RXQB) C229 N201.A9 (RXIA) C228 N201.A10 (RXIB) C226 Figure 4-20-18. RX I, Q signal Set the CW Mode of the Agillent 8960 Feed a CW signal at 2141MHz Set the RX Continuous mode Check the pk-pk level at N201.A7~A10 with About 120mVp-p? Change Wopy (N201)

  • Page 163: Checking Gsm Block

    4. TROUBLE SHOOTING 4.21 Checking GSM Block start 1. Check Regulator Circuit ➂ 2. Check VCXO Block 3. Check ➁ ➀ Ant. SW Module 4. Check ➄ ➅ Control Signal ➃ 5. Check RF TX Path 6. Check RF RX Path Redownload SW, Cal - 164 -...

  • Page 164: Checking Regulator Circuit

    4. TROUBLE SHOOTING 4.21.1 Checking Regulator Circuit Refer to 4.16 Checking Power Source block IF you already check this point while checking power source block , You can skip this test. 4.21.2 Checking VCXO Block Refer to 4.17 Checking VCXO block IF you already check this point while checking VCXO block , You can skip this test.

  • Page 165: Checking Control Signal

    4. TROUBLE SHOOTING 4.21.4 Checking Control Signal Test Program Script MODE=0 SWTX=1,64,7,1024,1 ➀ TXON VDD_A (R421) (C426) VDD_A VDD_A (L416) (L411) RADDA T ➂ (TP408) LPF block RADSTR (TP407) ➁ Vtune RADCL (C448) K(TP40 6) ➀ C433 C427 R421 TXON R412 RXON BSEL0...
  • Page 166 4. TROUBLE SHOOTING Figure 4-21-1. GSM RF Control signal Check TP406,TP408,TP407. Check if there is any Major difference. Refer to left side of Figure 4-21-1 Similar? Short? Redownload SW Change the board Check R421,C448. Check if there is any Major difference. Refer to right side of Figure 4-21-1 Resoldering VDD_A block Similar?

  • Page 167: Checking Rf Tx Path

    4. TROUBLE SHOOTING 4.21.5 Checking RF Tx Path A. GSM Tx path Level Figure 4-21-2. GSM/DCS/PCS Tx Path Level - 168 -...
  • Page 168 4. TROUBLE SHOOTING ➀ ➃ ➃' N404 N403 N401 ➂ ➂' ➄ ➁ ➄' N405 Figure 4-21-3. Test Point of GSM/DCS/PCS Tx Path ➀ W101 KMS-507 C103 L101 R101 ANTPAD101 1.8nH L102 FL101 C101 8.2nH LMSP43MA-288 1.2p GSM900_RX GSM1800_RX GSM1900_RX WCDMA GSM18001900_TX GSM_RX...
  • Page 169 4. TROUBLE SHOOTING B. GSM Tx Output Level Check ➀ Figure 4-21-4. GSM/DCS/PCS Tx Level at Test Program Script 2. DCS Tx 3. PCS Tx 1. GSM Tx MODE=0 MODE=2 MODE=1 SWTX=1,699,0,1024,1 SWTX=1,661,0,1024,1 SWTX=1,64,5,1024,1 v Agilent 8960 Setting : GSM BCH+TCH Mode v Oscilloscope Setting ➀...
  • Page 170 4. TROUBLE SHOOTING C. GSM RF Transceiver IN/OUT Signal Check DCS/PCS Tx GSM Tx ➃ (R414) (R418) N404 MODA N403 (R410) GSM Tx (L406) MODB ➁ (R411) ➂ MODC (R424) DCS/PCS Tx (L405) MODD (R423) N404 LDB21897M15C R418 L406 R419 33nH C429 R417...
  • Page 171 4. TROUBLE SHOOTING MODA MODB Figure 4-21-5. GSM/DCS/PCS Tx MODE signal Check Mode(A/B/C/D)signal at ➁ Similar? Resoldering MODE block Check if there is any Major (R423, R424, R411, R410) difference. Refer to Figure 4-21-5 Check GSM RF Transceiver GSM/DCS/PCS ➂ Redownload SW Output power at >5dBm...
  • Page 172 4. TROUBLE SHOOTING D. GSM PAM Check GSM Tx (C410) Vapc (C406) ➄ DCS Tx (C409) BLM15AB601SN1J L401 PAREG R402 R401 C401 C402 IOUT 100p 150p ➄ C406 C405 100p C407 C410 GSM_TX DCS_PCS_IN EGSM_OUT C411 DCS_TX DCS_PCS_OUT EGSM_IN R403 2.2nH SKY77321 C409...
  • Page 173 4. TROUBLE SHOOTING TXON TXON Vapc (GSM) Vapc (DCS/PCS) Figure 4-21-6. GSM Tx control signal Figure 4-21-7. DCS/PCS Tx control signal Check Vapc level. Check if there is any Major Vapc>1.5 V? Redownload SW, Cal difference. Refer to Graph 4-21-6/7 Changing GSM PAM Check GSM/DCS PAM GSM:33.5dBm...
  • Page 174 4. TROUBLE SHOOTING 4.21.5 Checking RF Tx Path A. GSM Tx path Level Figure 4-21-2. GSM/DCS/PCS Tx Path Level - 175 -...
  • Page 175 4. TROUBLE SHOOTING FL402 ➂' FL403 ➀ N405 Z401 ➂ ➁ Test Program Script 1. GSM Tx 2. DCS/PCS Tx MODE=0 MODE=2(DCS),1(PCS) SWTX=1,64,5,1024,1 SWTX=1,699,0,1024,1 v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1889.0MHz) v Oscilloscope Setting - 176 -...
  • Page 176 4. TROUBLE SHOOTING B. GSM I/Q Signal Check Idata (TP402) ➀ DCLK (TP403) (R428) Qdata (TP404) (R429) ➁ (R430) (R431) ➀ TP402 TP403 TP404 N402 LZN-901-0536-R1A AVDD I2CDAT QDATA I2CCLK QDAT IDATA SYSCLK2_MCLK IDAT RESETON_RESETB DCLK DCLK AUXO2 BEARP RXSTR BEARN PCMUL ➁...
  • Page 177 I Data Q Data DCLK Figure 4-21-9. Herta IQ data and DCLK Figure 4-21-10. Ingela IQ signal Figure 4-21-11. Ingela IQ signal - 178 -...
  • Page 178 v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1889.0MHz) v Oscilloscope Setting Check GSM/DCS/PCS Rx ➀ IQ data at Similar? Redownload SW, Cal Redownload SW, Cal Check if there is any Major difference. Refer to Graph 4-21-9. Check GSM/DCS/PCS Rx IQ IQ signal ➁...
  • Page 179 C. GSM RF Level Check ➂' FL402 ➂' FL403 Z401 ➂ Figure 4-21-12. GSM/DCS/PCS Rx path Z401 SAFEC942MFL0F00 FL402 FL403 SAFEC1G84FA0F00 SAFEC1G96FA0F00 C431 C437 C412 PCS_RX DCS_RX GSM_RX 1.5nH v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1889.0MHz) Check GSM/DCS/PCS Rx ➂...

  • Page 180: Checking Bluetooth Block

    4.22 Checking Bluetooth Block ➁ ➀ <Bottom view> start 1. Check BT Regulator Block 2. Check BT Chip Block ** BT - Bluetooth - 181 -...

  • Page 181: Bottom View

    VDIG VBATI R2171 R2192 100K U510 R2186 VOUT R2179 R599 BTF_REG_EN R1131N281D5-TR-F R2177 C1899 C1915 C594 4.7u 4.7u 1608 1608 BT and T-Flash Regulator-2.85V U604 BGB202_S2 R650 CLKREQ GPIO10 GP_CLK REF_CLK R651 RESOUT2n RESET_N TCK_JTAG TMS_JTAG TDI_JTAG UARTRTS3 GPIO2_CTS_UART TDO_JTAG UARTCTS3 GPIO3_RTS_UART UARTRX3...
  • Page 182 Checking Bluetooth Regulator Block TP Command -pctr = 3,4,1 BTF_REG_EN R599 -pdin = 3,4 -pdou = 3,4,1 -brts =1 -ltcx = 3 -dacc =0,2 responsed value -Btfa=1,1 -Btfa=1,2 VBT at Regulator output R2186 voltage level at Check About BTF_REG_EN . R599 Check Marita (D601) 2.85V? with...
  • Page 183 Checking Bluetooth Block E5515C 8960 setting TP Command -Center Frequency => 2441MHz -pctr = 3,4,1 -Span =500kHz -pdin = 3,4 -pdou = 3,4,1 -brst =1 VBT C646 -ltcx = 3 → LTCX=response value,OK MCLK C643 -dacc =0,2 response value -Btfa=1,1 -Btfa=1,2 -Btsr=2 RTCCLK C642...

  • Page 184: Block Diagram

    5. BLOCK DIAGRAM 5.1 GSM & WCDMA RF Block UMTS UMTS IF Filter UMTS RF Filter Z201 FL201 Duplexer FL102 UMTS Receiver Antenna N201(Wop y ) D701 Wanda UMTS PAM Isolator N302 UMTS TX Filter Test Conn . Tank N303 FL301 W101 UMTS Transmitter...
  • Page 185 5. BLOCK DIAGRAM 5. BLOCK DIAGRAM Block Ref. Name Part Name Function Comment Common FL101 LMSP43MA-288 Switch Band select W101 KMS-507 Test Connector Calibration, etc B201 TSX-8A_13MHz Crystal Reference -13M WCDMA FL102 DFYY61G95LBNBC-TT1 Duplexer N201 LZT-108-5323 Receiver FL201 SAFEH2G14FA0F00R00 RX RF Filter Z201 TMXU753 RX IF Filter...

  • Page 186: Download

    – The older version software of the phone can be replaced to the newer version. • Download Tools – FlashRW : Download tool for U8XX0 software 6.2 Download Environment Setup U8550 UART data cable USB cable Figure 6-2-1. U8XX0 Download can be done via UART & USB...

  • Page 187: U8Xxx Download

    6. DOWNLOAD 6. DOWNLOAD 6.3 U8XXX Download 6.3.1. U8XXX Download(1) - FlashRW configuaration A. Execute FlashRW_V200_Red.exe B. Press the “Global Settings” on the top menu to configure FlashRW environment. - 188 -...
  • Page 188 C. Select Loader File for Product. You can use browse button to select Loader File. You must select only cxc1325414_R3V_u8550R. fldr for U8550. Loader File is provided with FlashRW. D. Select Port configurations for both RS232 Port and USB Port.
  • Page 189 6. DOWNLOAD 6.3.1. U8XXX Download(2) - Phone Model Selection A. Press Button for Model. B. Select Model U8120 for U8550. - 190 -...
  • Page 190 6. DOWNLOAD 6.3.1. U8XXX Download(3) - Download file selection A. 1. Press “Add” button to select LGE SSW files to download. B. Don’t Press “Add1” button to select LGE GDFS file to download. If you download old released LGE GDFS file, The phone will break down. This “Add1”...
  • Page 191 6. DOWNLOAD 6.3.1. U8XXX Download(4) - Connect & Download A. Click on connector icon( ) to connect to the phone Check the Dialog Box that say “Please,switch on the target”. B. Connect the phone to PC via Cable for Downloading. Phone should be turned off. C.
  • Page 192 6. DOWNLOAD 6.3.1. U8XXX Download(5) - USB Driver Install A. If you use FlashRW Tool firstly, Error will happen because of USB Driver uninstalled. You have to do FlashRW USB Driver Installation only at the first time of installation - 193 -...
  • Page 193 6. DOWNLOAD B. Push “the Next Button” in Found New Hardware Wizard C. Select “Search for a suitable driver for my device” in Found New Hardware Wizard - 194 -...
  • Page 194 6. DOWNLOAD D. Select “Specify a location” in Found New Hardware Wizard E. Push “the Browse Button” , and then select “USB driver Information file” This File is provided with FlashRW. - 195 -...
  • Page 195 6. DOWNLOAD F. Push “the Next Button” in Found New Hardware Wizard G. Push “the Finish Button” in Found New Hardware Wizard - 196 -...
  • Page 196 6. DOWNLOAD H. Close FlashRW.exe I. Remove & Insert Main battery to reset the phone This action for USB Driver Install is done only at the first time of installation If you want to download Software, just do as same as U8XXX Download (4) - Connect & Download says - 197 -...
  • Page 197 6. DOWNLOAD 6.3.1. U8XXX Download(6) - Connect & Download <While Downloading> < After Downloading finished > - 198 -...
  • Page 198 6. DOWNLOAD 6.3.1. U8XXX Download(7) - Trouble shooting Check these questions when trouble happens. A. Check if UART & USB Port configuration is right. B. Do not change RS-232 baud rate(115200BPS). It is fixed and never changed. C. Check if UART & USB Cable is connected. D.

  • Page 199: Calibration

    7.1 General Description This document describes the construction and the usage of the software used for the calibration of LG’s GSM/GPRS/WCDMA Multimedia Mobile Phone (U8550). The calibration menu and their results are displayed in PC terminal by Mobile phone. This calibration software includes GSM, DCS, WCDMA Band RF parts calibration and Battery calibration.

  • Page 200: Calibration Explanation

    7. CALIBRATION 7.3 Calibration Explanation 7.3.1 Overview In this section, it is explained each calibration item in the XCALMON. Also the explanation includes technical information such as basic formula of calibration and settings for key parameters in each calibration procedure. At first, when any of calibration is done, the results are displayed in the XCALMON result window and the result of calibration will be stored in GDFS(Global Data Flash Storage).

  • Page 201: Egsm 900 Calibration Items

    7. CALIBRATION 7.3.3 EGSM 900 Calibration Items A. MOD-A(MD bit) Delay Calibration - Purpose The procedure is designed to calibrate the timing alignment between the MODA-D signals and the reference signal (13 MHz). It also ensures that the MOD signals have stable values when they are clocked into the divider of the Phase-Locked Loop (PLL).
  • Page 202 7. CALIBRATION B. RXVCO Varactor Operating Point Calibration - Purpose To adjust the varactor diode to a pre-determined operating point, so that the loop voltage of the RXVCO (measured with an ADC in AB 2000) is within the valid range. This is necessary to secure that all RX channels can be reached.
  • Page 203 7. CALIBRATION - Procedure Proposal 1. Put the ME in switched TX mode on mid channel in frequency interval 11 for EGSM (with random modulation). 2. Measure the RMS phase error at the RF connector. 3. Tune the phase detector current (IPHD) until the phase error is minimized. If two IPHD settings gave the same RMS, choose the lowest value.
  • Page 204 7. CALIBRATION Acquire the following VCXO (13 MHz) frequencies: fmin = 13 MHz VCXO-frequency @ DAC3=1 fmid = 13 MHz VCXO-frequency @ DAC3=1024 fmax = 13 MHz VCXO-frequency @ DAC3=2047 Note that it is necessary to translate the measured RF-frequency (EGSM, DCS, or W-CDMA) to the 13 MHz VCXO-frequency.
  • Page 205 7. CALIBRATION Parameter Target Full Power (dBm) Tolerances (dB) PL 5 33.0 +0.5 – 1.0 PL 6 31.0 ±0.3 PL 7 29.0 ±0.5 PL 8 27.0 ±0.5 PL 9 25.0 ±0.5 PL 10 23.0 ±0.5 PL 11 21.0 ±0.5 PL 12 19.0 ±0.5 PL 13...

  • Page 206: Dcs 1800 Calibration Items

    7. CALIBRATION 5. Calculate the difference between on and off (converting the result to ‚real dB attenuation) and store the result in GD_MPH_RX_AGC_Parameters_Band. 7.3.4 DCS 1800 Calibration Items A. RXVCO Varactor Operating Point Calibration - Purpose To adjust the varactor diode to a pre-determined operating point, so that the loop voltage of the RXVCO (measured with an ADC in AB 2000) is within the valid range.
  • Page 207 7. CALIBRATION - Procedure Proposal 1. Put the ME in switched TX mode on mid channel in frequency interval 11 for DCS (with random modulation). 2. Measure the RMS phase error at the RF connector. 3. Tune the phase detector current (IPHD) until the phase error is minimized. If two IPHD settings gave the same RMS, choose the lowest value.
  • Page 208 7. CALIBRATION 3. To avoid yield problems with the power template and switching transients spectrum a margin to the compression point of the PA should be observed. However, the output power must be kept within the tolerances specified in Table 10-5. 4.

  • Page 209: Wcdma Calibration Items

    7. CALIBRATION E. RSSI Calibration - Purpose This procedure calibrates an absolute power level on the antenna against a corresponding RSSI value. This value together with a pre-defined slope figure is then used to calculate the RSSI value of an arbitrary received antenna power. The formula y=kx+m is used. (Where k is the slope value, x the RSSI value, y the actual level, and m is an offset value).
  • Page 210 7. CALIBRATION 2. Measure the relative power between the 1950 MHz carrier and 1949.04 MHz at the antenna output. Jump to step 6 if the requirement is met. 3. Step RECDCI from 0 to 3. Set TXON = 0 and wait 1 ms before changing RECDCI from 3 to 5. Set TXON = 1, wait 1 ms and continue with stepping from 5 to 7.
  • Page 211 13. If the requirements are not met, step the gain down and measure ACLR until the requirements are met. Use known correlation from earlier calibrated units to calculate the new gain setting. 14. This power, Pmax meas LG, and gain setting provides input to the calibration of TX power table. E. TX Power Table Calibration...
  • Page 212 7. CALIBRATION (7) Size of step between LG/MG and MG/HG and between each setting of RFBIAS (1-7). The main purpose is to find the relative difference at different frequencies. Distribute with equal frequency offset except if there are known ‚worst-case frequencies. Measured at 5 channels, maximum and minimum steps reported.
  • Page 213 7. CALIBRATION E. TX Open Loop Power Control Calibration - Purpose The purpose of the calibration of open loop power control is to store parameters for the Open Loop Power Control algorithm. This is a pure off-line calculation. Use data (positions and output power, in dBm) from table 0.
  • Page 214 7. CALIBRATION F. RX LPF Bandwidth Calibration - Purpose This procedure calibrates the LPF bandwidth. The bandwidth of the channel filters will affect system parameters as reception sensitivity and adjacent channel selectivity. The procedure also verifies that the IF-filter is properly matched. Figure 7-3.
  • Page 215 7. CALIBRATION F. RX LNA Gain Switch and AGC Hysteresis Calibration - Purpose This procedure calibrates the gain correction parameter of Ak in the AGC algorithm between GLNA=0 and GLNA=1; that is, it establishes the gain difference in the LNA between high gain mode and low gain mode.
  • Page 216 7. CALIBRATION G. RX AGC Gain Max and RX RSSI Calibration - Purpose To prevent wind up in AGC algorithm, this procedure calibrates the absolute power levels at the antenna connector against RSSI values and the maximum gain setting for AGC. Reference [6] specifies that the reporting range of the RSSI should be between -100 dBm to -25 dBm.

  • Page 217: Baseband Calibration Item

    7. CALIBRATION 7.3.6 Baseband Calibration Item A. Battery Voltage Calibration - Purpose Calibrates the voltage table for the power management functionality. Some voltage measurements in the remaining test will be done with calculated voltage levels from this test. - Procedure Proposal 1.

  • Page 218: Program Operation

    7.4 Program Operation 7.4.1 XCALMON Program Overview When you try to calibrate the U8550 mobile phone, you should make a configuration of calibration environment like Figure7-1. And if you finish making configuration, please execute the XCALMON program. Running the XCALMON program, you should show XCALMON program window like Figure7-5.

  • Page 219: Xcalmon Icon Description

    When you click the calibration window icon “C”, then you should see the calibration tree window. That will be shown all calibration items. If you want to calibrate U8550 mobile phone for all calibration items, you should select “Calibration” and push “F4” button in your keyboard.
  • Page 220 7. CALIBRATION Figure 7-7. XCALMON Calibration Tree Window (OUTPUT Tab) Figure 7-8. XCALMON Calibration Tree Window (INSTRUMENT Tab) - 221 -...
  • Page 221 C. ITP Starting Window Using Production Loader When you click the ITP starting window icon”L”, then you should see the ITP starting window. That dialog window just wait for power-on of U8550 mobile phone. When it will occur power-on, it automatically start ITP running.

  • Page 222: Calibration Procedure

    Click the “L” icon, then you will see the ITP start window like Figure7-10. When you will turn on the U8550 mobile phone, the production loader will be downloaded automatically like Figure7-11 and then it will execute the ITP at once.
  • Page 223 7. CALIBRATION Figure 7-11. Production Loader Downloading Figure 7-12. ITP Start Complete Window - 224 -...

  • Page 224: Calibration Result Message

    7. CALIBRATION C. Calibration Start Using XCALMON If you want to calibrate U8550 mobile phone, click the calibration icon “C”. And then you will see the calibration tree window like Figure7-6. To start calibration, you should select “Calibration” item and push “F4” button in your keyboard.
  • Page 225 7. CALIBRATION Figure 7-14. Calibration FAIL Message Window Figure 7-15. Calibration Result from OUTPUT Tab View - 226 -...
  • Page 226 7. CALIBRATION Figure 7-16. Calibration Result from STATUS Tab View - 227 -...
  • Page 227 - 228 -...

  • Page 228: Circuit Diagram

    R105 BYPASS VOUT_SE GND1 C113 C114 C112 0.1u 0.033u 2012 Engineer: Engineer: LG ELECTRONICS INC. JS Joo Drawn by: Drawn by: Mobile Handsets R&D Center HW Group, Develpment Lab 6 JS Joo R&D CHK: R&D CHK: TITLE: TITLE: Size: Size: U8550-spfy0106301-1.1...
  • Page 229 WCLK C217 WSTR 5600p R207 GPRFCTRL R208 CLKREQ FROM MARITA SIDE FOR POWER SAVING Engineer: LG ELECTRONICS INC. JS Joo Mobilehandsets R&D Center Drawn by: HW Group, Development Lab 6 JS Joo R&D CHK: Size: TITLE: U8550-spfy0106301-1.1 DOC CTRL CHK:...
  • Page 230 R313 R318 4.7K C329 C334 C336 R312 V_wivi_B 150p 3300p Engineer: LG ELECTRONICS INC. JS Joo Mobile Handsets R&D Center Drawn by: HW Group, Development Lab 6 JS Joo R&D CHK: Size: TITLE: U8550-spfy0106301-1.1 DOC CTRL CHK: 12 1 8 A...
  • Page 231 C439 C445 C447 C448 C450 C449 0.01u 1200p 560p 330p 0.01u Engineer: LG ELECTRONICS INC. JS Joo Mobile Handsets R&D Center Drawn by: HW Group, Development Lab 6 JS Joo R&D CHK: Size: TITLE: U8550-spfy0106301-1.1 DOC CTRL CHK: GSM/DCS (INGELA)
  • Page 232 VSSTH16 VDD1 C517 C519 C578 VDD2 2700p C525 R531 SPK_RIGHT_M C560 SPK_RIGHT_P Engineer: LG ELECTRONICS INC. R530 Jeongseok Lee AUDIO_AMP_EN Mobile Handsets R&D Center Drawn by: HW Group, Development Lab 6. Jeongseok Lee R529 R&D CHK: TITLE: Size: 100K U8550-spfy0106301-1.1...
  • Page 233 470K R2242 R2243 C617 0.1u R2246 R2247 I2CDAT_VGA Trans-Flash I2CCLK_VGA Engineer: LG ELECTRONICS INC. Jeongseok Lee Mobile Handsets R&D Center Drawn by: HW Group, Development Lab 6. Jeongseok Lee R&D CHK: Size: TITLE: U8550-spfy0106301-1.1 DOC CTRL CHK: MARITA, MEMORY, BLUETOOTH...
  • Page 234 VBAT VBAT ON_SW ON_SW UFLS R743 C732 2.5G 0.1u UART1 Engineer: LG ELECTRONICS INC. Jeongseok Lee Mobile Handsets R&D Center Drawn by: HW Group, Development Lab 6 Jeongseok Lee R&D CHK: TITLE: Size: U8550-spfy0106301-1.1 DOC CTRL CHK: 12 1 8 A...
  • Page 235 Date Sign & Name Sheet/ Sheets MODEL U8550(GD32) 100K 7/27 Designer JS Lee 0.1u 2004 PG05DBTFC 100K Checked DRAWING PG05DBTFC U8550 Keypad-1.0 KEY_LED- NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. enter draw_number LGIC(42)-A-5505-10:01 LG Electronics Inc.
  • Page 236 CIRES_1.3M FPCB-to-1.3M Connector Section Date Sign & Name Sheet/ Sheets MODEL U8550 03/28 Designer JS Lee 2005 Checked DRAWING U8550 Mega Camera FPCB-1.0 NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. enter draw_number LGIC(42)-A-5505-10:01 LG Electronics Inc.
  • Page 237 AXK8L40125G Header LCD Connector Section Date Sign & Name Sheet/ Sheets U8550(GD32) MODEL 04/26 Designer JS Lee 2005 Checked DRAWING U8550 LCD FPCB-1.0 NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. enter draw_number LGIC(42)-A-5505-10:01 LG Electronics Inc.

  • Page 238: Pcb Layout

    9. PCB LAYOUT...
  • Page 239 9. PCB LAYOUT...
  • Page 240 9. PCB LAYOUT...
  • Page 241 9. PCB LAYOUT...
  • Page 242 9. PCB LAYOUT...
  • Page 243 9. PCB LAYOUT...
  • Page 244 9. PCB LAYOUT...
  • Page 245 9. PCB LAYOUT...

  • Page 247: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 23-1...
  • Page 248 DESCRIPTION Q'TY DRAWING NO DRAWING NO REMARK DESCRIPTION Q'TY DRAWING NO DRAWING NO REMARK WINDOW LCD(SUB) AWAZ00071## 01:SILVER, 02:GREEN, 03:ORANGE BUTTON,SIDE MBJL0022901 DECO(3 LOGO) MDAY0006801 PLATE,FACE MPFC0070301 DECO FOLDER(UPPER) MDAE00304## 01:SILVER, 02:GREEN, 03:ORANGE COVER,FRONT MCJK00418## 01:SILVER, 02:GREEN, 03:ORANGE TAPE,WINDOW(SUB) MTAE0023901 STOPPER MSGY00111## 01:SILVER, 02:GREEN, 03:ORANGE...

  • Page 250: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order <Mechanic component> is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark IMT,FOLDER TIFF0009903 Green AAAY00 ADDITION AAAY0128401 Green...
  • Page 251 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MGAD01 GASKET,SHIELD FORM MGAD0097801 LCD-UPPER CONTACT, 2POINT Color MKAZ00 KEYPAD MKAZ0023302 Green MPBF00 PAD,FLEXIBLE PCB MPBF0012401 Black MPBQ00 PAD,LCD(SUB) MPBQ0024101 Black Without MTAA00 TAPE,DECO MTAA0094701 Color Without...
  • Page 252 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCH00 CAP,SCREW MCCH0054501 SILICON RUBBER, FOLDER LIGHT Gray MCCH01 CAP,SCREW MCCH0054601 SILICON RUBBER, FOLDER LEFT Gray MCCH02 CAP,SCREW MCCH0054702 Green MCCH03 CAP,SCREW MCCH0054802 Green MGAZ01 GASKET MGAZ0022702 Gold...
  • Page 253 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MPBZ00 MPBZ0101301 Black Without MTAA00 TAPE,DECO MTAA0095101 Color Without MTAA01 TAPE,DECO MTAA0095201 Color Without MTAB00 TAPE,PROTECTION MTAB0089201 Color Without MTAB01 TAPE,PROTECTION MTAB0089301 Color Without MWAE00 WINDOW,CAMERA MWAE0009301 0.8T, PMMA SHEET...

  • Page 254: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order <Main component> is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0038001 Silver PCB ASSY, SACB00...
  • Page 255 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SACE00 PCB ASSY,FLEXIBLE,SMT SACE0033901 Silver PCB ASSY,FLEXIBLE,SMT SACD00 SACD0026301 Silver CONNECTOR,BOARD TO ENBY0025201 26 PIN,0.4 mm,ETC , ,H=0.9, Header BOARD CONNECTOR,BOARD TO ENBY0019101 24 PIN,0.4 mm,STRAIGHT , ,H1.5, MALE BOARD DIODE,LED,MODULE EDLM0005502...
  • Page 256 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP RES,CHIP...
  • Page 257 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark LD17 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD18 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD19 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED...
  • Page 258 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SAFY00 PCB ASSY,MAIN SAFY0134601 Silver SAFB00 PCB ASSY,MAIN,INSERT SAFB0053501 Green SBCL00 BATTERY,CELL,LITHIUM SBCL0001303 2 V,1 mAh,COIN ,SOLDER TYPE BACKUP BATTERY SAFF00 PCB ASSY,MAIN,SMT SAFF0059401 Silver PCB ASSY,MAIN,SMT SAFC00 SAFC0065801...
  • Page 259 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C210 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C211 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C212 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C214 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C215 CAP,CERAMIC,CHIP ECCH0000115...
  • Page 260 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C317 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C318 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C319 CAP,CERAMIC,CHIP ECCH0000181 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C320 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C321 CAP,CERAMIC,CHIP ECCH0000186...
  • Page 261 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C507 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C514 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C515 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C516 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP C518 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP C520 CAP,CERAMIC,CHIP ECCH0000122...
  • Page 262 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C576 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C588 CAP,CERAMIC,CHIP ECCH0005705 10 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP C591 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C595 CAP,CERAMIC,CHIP ECCH0005705...
  • Page 263 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C724 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C725 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C726 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C727 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C728 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C729 CAP,CERAMIC,CHIP ECCH0000137...
  • Page 264 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FL702 FILTER,EMI/POWER SFEY0006701 SMD ,CSP, 20 Ball 8ch EMI Filter /w ESD,Pb-free SMD ,4ch(2.0*1.25), 200MHz, 1000Mohm, 10V, 100mA, FL705 FILTER,EMI/POWER SFEY0007801 (29nH,47pF) SMD ,4ch(2.0*1.25), 200MHz, 1000Mohm, 10V, 100mA, FL706 FILTER,EMI/POWER SFEY0007801...
  • Page 265 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark u143 BGA ,143 PIN,R/TP ,ASIC / POWER MANAGEMENT N503 EUSY0132701 IC / VINCENNE N702 EUSY0153001 SOT23-5 ,5 PIN,R/TP ,150 mA LDO REGULATOR / 1.5V PT501 THERMISTOR SETY0005701 NTC ,47000 ohm,SMD ,F, Pb Free...
  • Page 266 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R217 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R2171 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R2179 FILTER,BEAD,CHIP SFBH0007103 75 ohm,1005 ,CHIP BEAD, 300mA R2186 FILTER,BEAD,CHIP SFBH0007103 75 ohm,1005 ,CHIP BEAD, 300mA R2191 RES,CHIP ERHY0000201...
  • Page 267 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R408 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R413 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R503 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R504 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R505 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R506 RES,CHIP ERHY0000201...
  • Page 268 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R551 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R552 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R553 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R554 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R555 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R556 RES,CHIP ERHY0000201...
  • Page 269 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R721 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R724 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R725 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R726 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R730 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R731 RES,CHIP ERHY0000201...
  • Page 270 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark U510 EUSY0232815 SOT23-5 ,5 PIN,R/TP ,2.85V,300mA,LDO,PBFREE HVQFN ,52 PIN,R/TP ,BLUETOOTH RADIO MODULE U604 EUSY0212002 WITH BASEBAND CONTROLLER_Pb free U701 EUSY0188103 QFN ,24 PIN,R/TP ,MAIN+FLASH UPTO400mAcontinuous V201 DIODE,VARIABLE CAP EDVY0001801...
  • Page 271 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C310 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C311 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C312 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C413 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP C414 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C415 CAP,CERAMIC,CHIP ECCH0000165...
  • Page 272 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C450 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C451 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C452 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C453 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C454 CAP,CERAMIC,CHIP ECCH0000186...
  • Page 273 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C570 CAP,CERAMIC,CHIP ECCH0000126 68 pF,50V,J,NP0,TC,1005,R/TP C571 CAP,CERAMIC,CHIP ECCH0000126 68 pF,50V,J,NP0,TC,1005,R/TP C572 CAP,TANTAL,CHIP ECTH0002702 1 uF,16V ,M ,STD ,1608 ,R/TP C573 CAP,TANTAL,CHIP ECTH0002702 1 uF,16V ,M ,STD ,1608 ,R/TP C574 CAP,CERAMIC,CHIP ECCH0000276...
  • Page 274 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C616 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C617 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C618 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C619 CAP,CERAMIC,CHIP ECCH0000168...
  • Page 275 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 1950 MHz,2140 MHz,1.45 dB,1.60 dB,41 dB,50 FL102 DUPLEXER,IMT SDMY0000701 dB,5.4*5.0*1.6 ,SMD , FL402 FILTER,SAW SFSY0024302 1842.5 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 FL403 FILTER,SAW SFSY0024303 1960 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 FL701 VARISTOR SEVY0005501...
  • Page 276 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark N501 EUSY0171302 SOT-23 ,5 PIN,R/TP ,150mA 3.3V LDO, Pb-free N502 EUSY0153001 SOT23-5 ,5 PIN,R/TP ,150 mA LDO REGULATOR / 1.5V CSP ,25 PIN,R/TP ,6 CHANNEL ESD FILTER, EMP N504 EUSY0171201 SOLUTION, Pb-free...
  • Page 277 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R420 INDUCTOR,CHIP ELCH0005015 6.8 nH,S ,1005 ,R/TP , R421 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R422 INDUCTOR,CHIP ELCH0005015 6.8 nH,S ,1005 ,R/TP , R423 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R424 RES,CHIP ERHY0000220...
  • Page 278 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R573 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R574 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R576 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R577 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R578 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R579 RES,CHIP ERHY0000201...
  • Page 279 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R616 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R617 RES,CHIP ERHY0000275 56K ohm,1/16W,J,1005,R/TP R618 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R619 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R620 RES,CHIP ERHY0000275 56K ohm,1/16W,J,1005,R/TP R621 RES,CHIP ERHY0000280...
  • Page 280 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Z401 FILTER,SAW SFSY0024301 942.5 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 SPFY PCB,MAIN SPFY0106301 FR-4 ,0.8 mm,STAGGERED-8 , SUMY00 MICROPHONE SUMY0010702 UNIT ,44 dB,4*1.5 ,spring type - 281 -...

  • Page 281: Accessory

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark MHBY00 HANDSTRAP MHBY0000404 Hand Strap 135mm Black 3.7 V,1400 mAh,1 CELL,PRISMATIC ,U8130 BATTERY(Li- SBPL00 BATTERY PACK,LI-ION...

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